32-PGM07002-20 vs 32-PGM07002-21 vs 32-PGM07002-10

 
PartNumber32-PGM07002-2032-PGM07002-2132-PGM07002-10
DescriptionIC & Component Sockets PIN GRID ARRAY WIRE WRAP 32 PINSIC & Component Sockets PIN GRID ARRAY WIRE WRAP 32 PINSIC & Component Sockets PIN GRID ARRAY SOLDER TAIL 32 PINS
Manufacturer--Aries Electronics
Product Category--Sockets for ICs, Transistors
Series--PGM
Type--PGA
Packaging--Bulk
Termination--Solder
Operating Temperature---55°C ~ 105°C
Mounting Type--Through Hole
Features---
Housing Material--Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins Grid---
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Tin
Contact Finish Thickness Mating--10μin (0.25μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--200μin (5.08μm)
Contact Material Post--Brass
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