336-PLS20019-12 vs 336-PLS20021-12 vs 336-PLS21022

 
PartNumber336-PLS20019-12336-PLS20021-12336-PLS21022
DescriptionIC & Component Sockets 336 PIN PGA GOLDIC & Component Sockets 336 PIN PGA GOLDIC & Component Sockets 336 PIN PGA NICKEL
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsSockets for ICs, TransistorsSockets for ICs, Transistors
RoHSN--
ProductZero Insertion Force (ZIF) Sockets--
Number of Positions336 Position--
Contact PlatingGold--
SeriesPLSPLSPLS
BrandAries Electronics--
Mounting StylePCB--
Product TypeIC & Component Sockets--
Factory Pack Quantity1--
SubcategoryIC & Component Sockets--
Type-PGA, ZIF (ZIP)PGA, ZIF (ZIP)
Packaging-BulkBulk
Termination-SolderSolder
Operating Temperature--65°C ~ 125°C-65°C ~ 125°C
Mounting Type-Through HoleThrough Hole
Features-Closed FrameClosed Frame
Housing Material-Polyphenylene Sulfide (PPS)Polyphenylene Sulfide (PPS)
Number of Positions or Pins Grid---
Pitch Mating-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Mating-GoldGold
Pitch Post-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Post-TinTin
Contact Finish Thickness Mating-30μin (0.76μm)30μin (0.76μm)
Contact Material Mating-Beryllium CopperBeryllium Copper
Contact Finish Thickness Post-200μin (5.08μm)200μin (5.08μm)
Contact Material Post-Beryllium CopperBeryllium Copper
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