4-1571551-3 vs 4-1571551-1 vs 4-1571551-2

 
PartNumber4-1571551-34-1571551-14-1571551-2
DescriptionIC & Component Sockets SOLID FRAME PC 14PIC & Component Sockets PC MOUNT 6 PINCONN IC DIP SOCKET 8POS GOLD
ManufacturerTE ConnectivityTE ConnectivityTE Connectivity AMP Connectors
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
RoHSEE-
ProductSocket PinsDIP / SIP Sockets-
Number of Positions14 Position--
Number of Rows2 Row--
TypeClosed Frame-DIP, 0.3" (7.62mm) Row Spacing
Pitch2.54 mm--
Termination StyleSolder Tail--
Contact PlatingGold--
Row Spacing7.62 mm--
Current Rating3 A--
FeaturesSeries 500-Closed Frame
Housing MaterialThermoplastic-Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Voltage Rating1 kV--
BrandTE ConnectivityTE Connectivity-
Case StyleDIP--
Contact MaterialBeryllium Copper--
Flammability RatingUL 94V-0--
Mounting StyleThrough Hole--
Maximum Operating Temperature+ 105 C--
Minimum Operating Temperature- 55 C--
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity3480-
SubcategoryIC & Component SocketsIC & Component Sockets-
Part # Aliases4-1571551-34-1571551-1-
Unit Weight0.240004 oz--
Series--500
Packaging--Tube
Termination--Solder
Operating Temperature---55°C ~ 125°C
Mounting Type--Through Hole
Number of Positions or Pins Grid--8 (2 x 4)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Gold
Contact Finish Thickness Mating--25μin (0.63μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--25μin (0.63μm)
Contact Material Post--Nickel
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