514-83-192M16-001148 vs 514-83-255M16-001148 vs 514-83-256M16-000148

 
PartNumber514-83-192M16-001148514-83-255M16-001148514-83-256M16-000148
DescriptionIC & Component SocketsCONN SOCKET BGA 255POS GOLDCONN SOCKET BGA 256POS GOLD
ManufacturerPreci-dip-Preci-Dip
Product CategoryIC & Component Sockets-Sockets for ICs, Transistors
RoHSY--
BrandPreci-dip--
Product TypeIC & Component Sockets--
Factory Pack Quantity24--
SubcategoryIC & Component Sockets--
Series--514
Type--BGA
Packaging--Bulk
Termination--Solder
Operating Temperature---55°C ~ 125°C
Mounting Type--Surface Mount
Features--Open Frame
Housing Material--Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins Grid--256 (16 x 16)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Tin
Contact Finish Thickness Mating--29.5μin (0.75μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post---
Contact Material Post--Brass
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