A2F500M3G-FGG256 vs A2F500M3G-FGG256M vs A2F500M3G-FGG256I

 
PartNumberA2F500M3G-FGG256A2F500M3G-FGG256MA2F500M3G-FGG256I
DescriptionFPGA - Field Programmable Gate Array A2F500M3G-FGG256IC FPGA 500K GATES 512KB 256FBGA SmartFusionIC FPGA 500K GATES 512KB 256-BGA SmartFusion
ManufacturerMicrochipMicrosemi CorporationMicrosemi Corporation
Product CategoryFPGA - Field Programmable Gate ArrayEmbedded - System On Chip (SoC)Embedded - System On Chip (SoC)
Shipping Restrictions--
RoHSY--
ProductA2F500M3G--
Number of Logic Elements5500--
Number of Logic Array Blocks LABs---
Number of I/Os117 I/O--
Operating Supply Voltage1.5 V--
Minimum Operating Temperature0 C-- 40 C
Maximum Operating Temperature+ 85 C-+ 100 C
Mounting StyleSMD/SMT-SMD/SMT
Package / CaseFPBGA-256--
PackagingTrayTrayTray
Data Rate400 kb/s--
SeriesA2F500SmartFusionRSmartFusionR
BrandMicrochip / Microsemi--
Number of Gates500000-500000
Maximum Operating Frequency100 MHz-100 MHz
Moisture SensitiveYes--
Operating Supply Current16.5 mA-2 mA
Product TypeFPGA - Field Programmable Gate Array--
Factory Pack Quantity90--
SubcategoryProgrammable Logic ICs--
Supply Voltage Max1.575 V--
Supply Voltage Min1.425 V--
Total Memory110592 bit--
TradenameSmartFusion-Actel
Package Case-256-LBGAFPBGA-256
Operating Temperature--55°C ~ 125°C (TJ)-40°C ~ 100°C (TJ)
Supplier Device Package-256-FBGA (17x17)256-FBGA (17x17)
Speed-80MHz80MHz
Core Processor-ARMR CortexR-M3ARMR CortexR-M3
Architecture-MCU, FPGAMCU, FPGA
MCU Flash-512KB512KB
MCU RAM-64KB64KB
Peripherals-DMA, POR, WDTDMA, POR, WDT
Connectivity-EBI/EMI, Ethernet, I2C, SPI, UART/USARTEBI/EMI, Ethernet, I2C, SPI, UART/USART
Primary Attributes-ProASICR3 FPGA, 500K Gates, 11520 D-Flip-FlopsProASICR3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of I Os--117 I/O
Number of Logic Array Blocks LABs--24
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