MT29C2G24MAAAAKAKD-5 IT TR vs MT29C2G24MAAAAKAKD-5 IT vs MT29C2G24MAAAAKAKD-5

 
PartNumberMT29C2G24MAAAAKAKD-5 IT TRMT29C2G24MAAAAKAKD-5 ITMT29C2G24MAAAAKAKD-5
DescriptionMultichip Packages MASSFLASH/MOBILE DDR 3GMultichip Packages MASSFLASH/MOBILE DDR 3G
ManufacturerMicron TechnologyMicron TechnologyMicron Technology Inc.
Product CategoryMultichip PackagesMultichip PackagesMemory
RoHSYY-
TypeNAND Flash, Mobile LPDDR1--
Memory Size2 Gbit, 1 Gbit-2G (256M x 8)(NAND), 1G (32M x 32)(LPDRAM)
Package / CaseTFBGA-137--
SeriesMT29CMT29C-
Mounting StyleSMD/SMT--
Maximum Clock Frequency200 MHz--
Minimum Operating Temperature- 40 C--
Maximum Operating Temperature+ 85 C--
Memory TypeFlash, LPDDR1-FLASH - NAND, Mobile LPDRAM
Organization256 M x 8, 32 M x 32--
PackagingReelTrayBulk
ProductNAND-Based MCP--
Speed200 MHz-200MHz
BrandMicronMicron-
Interface TypeParallel--
Supply Current Max35 mA--
Data Bus Width8 bit, 32 bit--
Moisture SensitiveYes--
Product TypeMultichip PackagesMultichip Packages-
Factory Pack Quantity10001140-
SubcategoryMemory & Data StorageMemory & Data Storage-
Supply Voltage Max3.6 V--
Supply Voltage Min1.7 V--
Timing TypeAsynchronous--
Package Case--137-TFBGA
Operating Temperature---40°C ~ 85°C (TA)
Interface--Parallel
Voltage Supply--1.7 V ~ 1.95 V
Supplier Device Package--137-TFBGA (10.5x13)
Format Memory--Multi-Chip (FLASH/RAM)
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