PartNumber | Y1628115K000B9W | Y162810R0000F9W | Y1628108K760T0W |
Description | RES SMD 115K OHM 0.1% 3/4W 2512 | VSMP2512 10R000 TCR0.2 1.0% S W | Res Metal Foil 2512 108.76K Ohm 0.01% 3/4W ±0.2ppm/°C Molded SMD SMD Waffle Pack - Trays (Alt: VSMP2512108K76TCR0.2TBW) |
Manufacturer | Vishay Foil Resistors (Division of Vishay Precision Group) | - | Vishay Foil Resistors (Division of Vishay Precision Group) |
Product Category | Chip Resistor - Surface Mount | - | Chip Resistor - Surface Mount |
Series | VSMP | - | VSMP |
Packaging | Tray - Waffle | - | Tray - Waffle |
Height | 0.025" (0.64mm) | - | 0.025" (0.64mm) |
Package Case | 2512 (6432 Metric) | - | 2512 (6432 Metric) |
Operating Temperature | -55°C ~ 150°C | - | -55°C ~ 150°C |
Features | Moisture Resistant, Non-Inductive | - | Moisture Resistant, Non-Inductive |
Size Dimension | 0.249" L x 0.127" W (6.32mm x 3.23mm) | - | 0.249" L x 0.127" W (6.32mm x 3.23mm) |
Supplier Device Package | 2512 | - | 2512 |
Power Watts | 0.75W, 3/4W | - | 0.75W, 3/4W |
Resistance Ohms | 115k | - | 108.76k |
Tolerance | ±0.1% | - | ±0.01% |
Number of Terminations | 2 | - | 2 |
Temperature Coefficient | ±0.2ppm/°C | - | ±0.2ppm/°C |
Composition | Metal Foil | - | Metal Foil |
Failure Rate | - | - | - |