Amphenol

Newest Products
  • Minitek® Pwr 4.2 Connector System

    Amphenol ICC's Minitek Pwr 4.2 mm is a flexible and comprehensive solution designed for power application with current rating up to 9 A per circuit.

    Date: 2019-04-29
  • Minitek® Pwr 3.0 Connector System

    Amphenol ICC's Minitek Pwr 3.0 is a flexible and comprehensive solution designed for power application with current rating up to 5 A per circuit.

    Date: 2019-04-29
  • Minitek® 1.50 mm Connectors

    Amphenol ICC’s Minitek 1.50 mm connectors are designed with a positive locking system and audible click for secure mating retention.

    Date: 2019-04-19
  • Griplet®: Miniature IDC Connector for Wire-to

    Amphenol ICC's new Griplet connector offers a robust solution for miniature IDC wire to board connections. The low profile and compact design makes Griplet an ideal connector where space is ti

    Date: 2019-04-19
  • Waterproof USB Type-C™ Connectors

    Amphenol ICC's waterproof USB Type-C™ connectors are tailored for emerging product designs and support a variety of protocols.

    Date: 2019-03-11
  • Minitek® 2.00 mm Pitch Connectors

    Amphenol ICC's Minitek series is a fully modular system enabling all types of connections between PCBs, wires, and flat cables for flexible design.

    Date: 2019-02-26
  • Minitek® 0.80 mm Wire-to-Board Connector Syst

    Amphenol ICC's Minitek® 0.80 mm connector system is an ideal solution for devices that require compact and low-profile connectors.

    Date: 2019-01-17
  • Millipacs® High-Speed Connectors

    Amphenol ICC's Millipacs® connectors enable a cost-effective upgrade to data rates up to 25 Gb/s in accordance with a variety of standards.

    Date: 2018-12-06
  • Minitek® 1.00 mm Wire-to-Board Connector Syst

    Amphenol ICC's Minitek® 1.00 mm connector system is the ideal solution for devices that require compact and low-profile connectors.

    Date: 2018-12-04
  • BergStak® Lite 0.80 mm Board-to-Board Connect

    Amphenol ICC's BergStak® Lite 0.80 mm is a comprehensive and versatile solution designed for high-density applications with the need for lower mating cycles.

    Date: 2018-10-15
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