March 12, 2019, San Diego, Calif. – MACOM Technology Solutions Inc. (“MACOM”), a leading global semiconductor solutions provider, today announced the launch of two four-channel (4 x 100G) MATA-03820 and MATA-03819 The 56/106 Gb PAM-4 Linear Transimpedance Amplifier (TIA) production version delivers optimized performance for cloud data center 400G optical modules. The new MATA-03820 and MATA-03819 offer flip-chip and wire-bonded packages for fast and flexible deployment of single λ400G-FR4 and DR4 optical modules in QSFP-DD and OSFP packages.
MACOM introduces a transimpedance amplifier production version that supports bandwidths up to 35 GHz
MACOM's MATA-03820 and MATA-03819 TIA series deliver industry-leading low-noise performance (typically less than 1.5 uA RMS) and support bandwidths up to 35 GHz to support high-throughput optical data links with low power. Ideal for high-density data center optical interconnects. Features include RSSI for optical alignment and power monitoring, and an I2C management interface for controlling bandwidth, output amplitude, peak, signal loss (LOS), gain, and other key parameters.
Adit Narasimha, Vice President and General Manager of Molex Optoelectronics, said: “Molex is pleased to partner with MACOM. With MACOM's technical support and extensive TIA portfolio, we are able to offer industry-leading 400G optical modules. MACOM's TIA products have low noise performance and Flexible programmability, combined with DSP for 400G modules, delivers industry-leading low bit error rate performance."
Marek Tlalka, senior director of marketing for MACOM's High Performance Analog Products Division, said: "In the rapid development of 100G single mode fiber and 200G/400G parallel fiber optic connections, MACOM provides the high performance required to maximize broadband density in cloud data centers. , low-power optical components, once again established MACOM's leading position in the field. MACOM's MATA-03820 and MATA-03819 TIA series products, combined with comprehensive seamless interoperable MACOM components, will help customers accelerate this transition process."
In addition, MACOM offers samples of MATA-03921TIA (flip-chip package) and MATA-03919 TIA (wire bond package) to customers in the APD application area.
At the 2019 San Diego Fiber Optic Communications Network Exhibition and Conference (OFC 2019), MACOM demonstrated the rich PAM-4 chipset for 100G, 200G and 400G applications, including MATA-03820 and MATA-03819 TIA customer module applications. Showcase and live demonstration of the 200G/400G ROSA.