©2014 Silicon Storage Technology, Inc. DS20005053B 04/14
7
4 Mbit (x16) Multi-Purpose Flash Plus
SST39VF401C / SST39VF402C / SST39LF401C / SST39LF402C
Data Sheet
Device Operation
Commands are used to initiate the memory operation functions of the device. Commands are written
to the device using standard microprocessor write sequences. A command is written by asserting WE#
low while keeping CE# low. The address bus is latched on the falling edge of WE# or CE#, whichever
occurs last. The data bus is latched on the rising edge of WE# or CE#, whichever occurs first.
The SST39VF401C/402C and SST39LF401C/402C also have the Auto Low Power mode which puts
the device in a near standby mode after data has been accessed with a valid Read operation. This
reduces the I
DD
active read current from typically 5 mA to typically 3 µA. The Auto Low Power mode
reduces the typical I
DD
active read current to the range of 2 mA/MHz of Read cycle time. The device
exits the Auto Low Power mode with any address transition or control signal transition used to initiate
another Read cycle, with no access time penalty. Note that the device does not enter Auto-Low Power
mode after power-up with CE# held steadily low, until the first address transition or CE# is driven high.
Read
The Read operation of the SST39VF401C/402C and SST39LF401C/402C is controlled by CE# and OE#,
both have to be low for the system to obtain data from the outputs. CE# is used for device selection.
When CE# is high, the chip is deselected and only standby power is consumed. OE# is the output con-
trol and is used to gate data from the output pins. The data bus is in high impedance state when either
CE# or OE# is high. Refer to the Read cycle timing diagram for further details (Figure 6).
Word-Program Operation
The SST39VF401C/402C and SST39LF401C/402C are programmed on a word-by-word basis. Before
programming, the sector where the word exists must be fully erased. The Program operation is accom-
plished in three steps. The first step is the three-byte load sequence for Software Data Protection. The
second step is to load word address and word data. During the Word-Program operation, the
addresses are latched on the falling edge of either CE# or WE#, whichever occurs last. The data is
latched on the rising edge of either CE# or WE#, whichever occurs first. The third step is the internal
Program operation which is initiated after the rising edge of the fourth WE# or CE#, whichever occurs
first. The Program operation, once initiated, will be completed within 10 µs. See Figures 7 and 8 for
WE# and CE# controlled Program operation timing diagrams and Figure 22 for flowchar ts. During the
Program operation, the only valid reads are Data# Polling and Toggle Bit. During the internal Program
operation, the host is free to perform additional tasks. Any commands issued during the internal Pro-
gram operation are ignored. During the command sequence, WP# should be statically held high or low.
Sector/Block-Erase Operation
The Sector- (or Block-) Erase operation allows the system to erase the device on a sector-by-sector (or
block-by-block) basis. The SST39VF401C/402C and SST39LF401C/402C offer both Sector-Erase and
Block-Erase mode.
The sector architecture is based on a uniform sector size of 2 KWord. The Block-Erase mode is based
on non-uniform block sizes—seven 32 KWord, one 16 KWord, two 4 KWord, and one 8 KWord blocks.
See Figure 2 for top and bottom boot device block addresses. The Sector-Erase operation is initiated
by executing a six-byte command sequence with Sector-Erase command (50H) and sector address
(SA) in the last bus cycle. The Block-Erase operation is initiated by executing a six-byte command
sequence with Block-Erase command (30H) and block address (BA) in the last bus cycle. The sector
or block address is latched on the falling edge of the sixth WE# pulse, while the command (30H or
50H) is latched on the rising edge of the sixth WE# pulse. The internal Erase operation begins after the
©2014 Silicon Storage Technology, Inc. DS20005053B 04/14
8
4 Mbit (x16) Multi-Purpose Flash Plus
SST39VF401C / SST39VF402C / SST39LF401C / SST39LF402C
Data Sheet
sixth WE# pulse. The End-of-Erase operation can be determined using either Data# Polling or Toggle
Bit methods. See Figures 12 and 13 for timing waveforms and Figure 26 for the flowchart. Any com-
mands issued during the Sector- or Block-Erase operation are ignored. When WP# is low, any attempt
to Sector- (Block-) Erase the protected block will be ignored. During the command sequence, WP#
should be statically held high or low.
Erase-Suspend/Erase-Resume Commands
The Erase-Suspend operation temporarily suspends a Sector- or Block-Erase operation thus allowing
data to be read from any memory location, or program data into any sector/block that is not suspended
for an Erase operation. The operation is executed by issuing one byte command sequence with Erase-
Suspend command (B0H). The device automatically enters read mode typically within 20 µs after the
Erase-Suspend command had been issued. Valid data can be read from any sector or block that is not
suspended from an Erase operation. Reading at address location within erase-suspended sectors/
blocks will output DQ
2
toggling and DQ
6
at ‘1’. While in Erase-Suspend mode, a Word-Program opera-
tion is allowed except for the sector or block selected for Erase-Suspend.
To resume Sector-Erase or Block-Erase operation which has been suspended the system must issue
Erase Resume command. The operation is executed by issuing one byte command sequence with
Erase Resume command (30H) at any address in the last Byte sequence.
Chip-Erase Operation
The SST39VF401C/402C and SST39LF401C/402C provide a Chip-Erase operation, which allows the
user to erase the entire memory array to the ‘1’ state. This is useful when the entire device must be
quickly erased.
The Chip-Erase operation is initiated by executing a six-byte command sequence with Chip-Erase
command (10H) at address 555H in the last byte sequence. The Erase operation begins with the rising
edge of the sixth WE# or CE#, whichever occurs first. During the Erase operation, the only valid read is
Toggle Bit or Data# Polling. See Table 7 for the command sequence, Figure 11 for timing diagram, and
Figure 26 for the flowchart. Any commands issued during the Chip-Erase operation are ignored. When
WP# is low, any attempt to Chip-Erase will be ignored. During the command sequence, WP# should
be statically held high or low.
Write Operation Status Detection
The SST39VF401C/402C and SST39LF401C/402C provide two software means to detect the comple-
tion of a Write (Program or Erase) cycle, in order to optimize the system write cycle time. The software
detection includes two status bits: Data# Polling (DQ
7
) and Toggle Bit (DQ
6
). The End-of-Write detec-
tion mode is enabled after the rising edge of WE#, which initiates the internal Program or Erase opera-
tion.
The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a
Data# Polling or Toggle Bit read may be simultaneous with the completion of the write cycle. If this
occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with
either DQ
7
or DQ
6
. In order to prevent spurious rejection, if an erroneous result occurs, the software
routine should include a loop to read the accessed location an additional two (2) times. If both reads
are valid, then the device has completed the Write cycle, otherwise the rejection is valid.
©2014 Silicon Storage Technology, Inc. DS20005053B 04/14
9
4 Mbit (x16) Multi-Purpose Flash Plus
SST39VF401C / SST39VF402C / SST39LF401C / SST39LF402C
Data Sheet
Ready/Busy# (RY/BY#)
The devices include a Ready/Busy# (RY/BY#) output signal. RY/BY# is an open drain output pin that
indicates whether an Erase or Program operation is in progress. Since RY/BY# is an open drain out-
put, it allows several devices to be tied in parallel to V
DD
via an external pull-up resistor. After the rising
edge of the final WE# pulse in the command sequence, the RY/BY# status is valid.
When RY/BY# is actively pulled low, it indicates that an Erase or Program operation is in progress.
When RY/BY# is high (Ready), the devices may be read or left in standby mode.
Data# Polling (DQ
7
)
When the SST39VF401C/402C and SST39LF401C/402C are in the internal Program operation, any
attempt to read DQ
7
will produce the complement of the true data. Once the Program operation is
completed, DQ
7
will produce true data. Note that e v en though DQ
7
ma y hav e valid data immediately follow-
ing the completion of an internal Write operation, the remaining data outputs may still be inv alid: valid data on
the entire data bus will appear in subsequent successiv e Read cycles after an interv al of 1 µs. During internal
Erase operation, any attempt to read DQ
7
will produce a ‘0’. Once the internal Erase operation is com-
pleted, DQ
7
will produce a ‘1’. The Data# Polling is valid after the rising edge of fourth WE# (or CE#)
pulse for Program operation. For Sector-, Block- or Chip-Erase, the Data# Polling is valid after the ris-
ing edge of sixth WE# (or CE#) pulse. See Figure 9 for Data# Polling timing diagram and Figure 23 for
a flowchart.
Toggle Bits (DQ6 and DQ2)
During the internal Program or Erase operation, any consecutive attempts to read DQ
6
will produce
alternating ‘1’s and ‘0’s, i.e., toggling between 1 and 0. When the internal Program or Erase operation
is completed, the DQ
6
bit will stop toggling. The device is then ready for the next operation. For Sector-
, Block-, or Chip-Erase, the toggle bit (DQ
6
) is valid after the rising edge of sixth WE# (or CE#) pulse.
DQ
6
will be set to ‘1’ if a Read operation is attempted on an Erase-Suspended Sector/Block. If Pro-
gram operation is initiated in a sector/block not selected in Erase-Suspend mode, DQ
6
will toggle.
An additional Toggle Bit is available on DQ
2
, which can be used in conjunction with DQ
6
to check
whether a particular sector is being actively erased or erase-suspended. Table 3 shows detailed status
bits information. The Toggle Bit (DQ
2
) is valid after the rising edge of the last WE# (or CE#) pulse of
Write operation. See Figure 10 for Toggle Bit timing diagram and Figure 23 for a flowchart.
Note: DQ
7
and DQ
2
require a valid address when reading status information.
Table 3: Write Operation Status
Status DQ
7
DQ
6
DQ
2
R Y/BY#
Normal Operation Standard Program DQ
7
# Toggle No Toggle 0
Standard Erase 0 Toggle Toggle 0
Erase-Suspend
Mode
Read from Erase-Sus-
pended Sector/Block
1 1 Toggle 1
Read from Non-Erase-
Suspended Sector/Block
Data Data Data 1
Program DQ
7
# Toggle N/A 0
T3.0 25053

SST39VF401C-70-4C-MAQE

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 2.7V to 3.6V 4Mbit Multi-Purpose Flash
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union