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SST39VF401C-70-4I-EKE

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P38
©2014 Silicon Storage Technology, Inc. DS20005053B 04/14
34
4 Mbit (x16) Multi-Purpose Flash Plus
SST39VF401C / SST39VF402C / SST39LF401C / SST39LF402C
Data Sheet
Valid Combinations for SST39VF401C
SST39VF401C-70-4C-EKE SST39VF401C-70-4C-B3KE SST39VF401C-70-4C-MAQE
SST39VF401C-70-4I-EKE SST39VF401C-70-4I-B3KE SST39VF401C-70-4I-MAQE
Valid Combinations for SST39VF402C
SST39VF402C-70-4C-EKE SST39VF402C-70-4C-B3KE SST39VF402C-70-4C-MAQE
SST39VF402C-70-4I-EKE SST39VF402C-70-4I-B3KE SST39VF402C-70-4I-MAQE
Valid Combinations for SST39LF401C
SST39LF401C-55-4C-EKE SST39LF401C-55-4C-B3KE SST39LF401C-55-4C-MAQE
Valid Combinations for SST39LF402C
SST39LF402C-55-4C-EKE SST39LF402C-55-4C-B3KE SST39LF402C-55-4C-MAQE
Note:Valid combinations are those products in mass production or will be in mass production. Consult your Micro-
chip sales representative to confirm availability of valid combinations and to determine availability of new
combinations.
©2014 Silicon Storage Technology, Inc. DS20005053B 04/14
35
4 Mbit (x16) Multi-Purpose Flash Plus
SST39VF401C / SST39VF402C / SST39LF401C / SST39LF402C
Data Sheet
Packaging Diagrams
Figure 27:48-lead Thin Small Outline Package (TSOP) 12mm x 20mm
Package Code: EK
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-14036A Sheet 1 of 1
48-Lead Thin Small Outline Package (EKE/F) - [TSOP]
48-tsop-EK-8
Note:
1. Complies with JE
DEC publication 95 MO-142 DD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
©2014 Silicon Storage Technology, Inc. DS20005053B 04/14
36
4 Mbit (x16) Multi-Purpose Flash Plus
SST39VF401C / SST39VF402C / SST39LF401C / SST39LF402C
Data Sheet
Figure 28:48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm
Package Code: B3K
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-14035A Sheet 1 of 1
48-Lead Thin Fine-Pitch Ball Grid Array (B3KE/F) - 6x8 mm Body [TFBGA]
48-tfbga-B3K-6x8-450mic-5
Note:
1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2.
All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P38

SST39VF401C-70-4I-EKE

Mfr. #:
Buy SST39VF401C-70-4I-EKE
Manufacturer:
Microchip Technology
Description:
NOR Flash 2.7 to 3.6V 4Mbit Multi-Purpose Flash
Lifecycle:
New from this manufacturer.
Delivery:
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