©2011 Silicon Storage Technology, Inc. S725081A 10/11
25
1 Mbit SPI Serial Flash
SST25VF010A
Data Sheet
A
Microchip Technology Company
Product Ordering Information
Valid combinations for SST25VF010A
SST25VF010A-33-4C-SAE SST25VF010A-33-4C-QAE
SST25VF010A-33-4I-SAE SST25VF010A-33-4I-QAE
SST25VF010A-33-4E-SAE SST25VF010A-33-4E-QAE
Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST
sales representative to confirm availability of valid combinations and to determine availability of new combi-
nations.
SST 25 VF 010A - 33 - 4I - QAE
XX XX XXXX - XX - XX
-
XXX
Environmental Attribute
E
1
= non-Pb
Package Modifier
A = 8 leads or contacts
Package Type
S = SOIC
Q = WSON
Temperature Range
C = Commercial = 0°C to +70°C
I = Industrial = -40°C to +85°C
E = Extended = -20°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Operating Frequency
33 = 33 MHz
Device Density
010 = 1 Mbit
Voltage
V = 2.7-3.6V
Product Series
25 = Serial Peripheral Interface
flash memory
1. Environmental suffix “E” denotes non-Pb sol-
der. SST non-Pb solder devices are “RoHS
Compliant”.
©2011 Silicon Storage Technology, Inc. S725081A 10/11
26
1 Mbit SPI Serial Flash
SST25VF010A
Data Sheet
A
Microchip Technology Company
Packaging Diagrams
Figure 22: 8-lead Small Outline Integrated Circuit (SOIC) 150 mil body width (4.9mm x 6mm)
SST Package Code: SA
08-soic-5x6-SA-8
Note: 1. Complies with JEDEC publication 95 MS-012 AA dimensions,
although some dimensions may be more str ingent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.
TOP VIEW
SIDE VIEW
END VIEW
5.0
4.8
6.20
5.80
4.00
3.80
Pin #1
Identifier
0.51
0.33
1.27 BSC
0.25
0.10
1.75
1.35
4 places
0.25
0.19
1.27
0.40
45°
4 places
1mm
©2011 Silicon Storage Technology, Inc. S725081A 10/11
27
1 Mbit SPI Serial Flash
SST25VF010A
Data Sheet
A
Microchip Technology Company
Figure 23:8-contact Very-very-thin Small Outline No-lead (WSON)
SST Package Code: QA
Note: 1. All linear dimensions are in millimeters (max/min).
2. Untoleranced dimensions (shown with box surround)
are nominal target dimensions.
3. The external paddle is electrically connected to the
die back-side and possibly to certain V
SS
leads.
This paddle can be soldered to the PC board;
it is suggested to connect this paddle to the V
SS
of the unit.
Connection of this paddle to any other voltage potential can
result in shorts and/or electrical malfunction of the device.
8-wson-5x6-QA-9.0
4.0
1.27 BSC
Pin #1
0.48
0.35
0.076
3.4
5.00 ± 0.10
6.00 ± 0.10
0.05 Max
0.70
0.50
0.80
0.70
0.80
0.70
Pin #1
Corner
TOP VIEW BOTTOM VIEW
CROSS SECTION
SIDE VIEW
1mm
0.2

SST25VF010A-33-4C-SAE-T

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 1M (128Kx8) 33MHz 2.7-3.6V Commercial
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union