PDF: 09005aef8326e5ac / Source: 09005aef8326e59a Micron Technology, Inc., reserves the right to change products or specifications without notice.
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
15 ©2008 Micron Technology, Inc. All rights reserved.
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Revision History
Preliminary
Revision History
Rev. E, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/09
• “NAND Flash-Specific Features” on page 1: Deleted device size bullet.
• Figure 2: “152-Ball Part Number Chart,” on page 2: Added U and V options under
NAND Flash configurations; deleted low-power option under LPDRAM self refresh
current; added dimensions to package codes; added CS# to first column under chip
count; changed CE# from 2 to 1 for B and D under chip count.
• Tabl e 1, “Production Part Numbers,” on page 3: Replaced former table 1.
• Figure 3: “152-Ball VFBGA Ball Assignments (NAND x8; LPDDR x16),” on page 5:
Updated figure.
• Figure 4: “152-Ball VFBGA Ball Assignments (NAND x16; LPDDR x32),” on page 6:
Updated figure.
• Tabl e 2, “x8/x16 NAND Ball Descriptions,” on page 7: Updated table.
• Tabl e 3, “x16/x32 LPDDR Ball Descriptions,” on page 8: Updated table.
• Tabl e 4, “Non-Device-Specific Ball Descriptions,” on page 8: Updated table.
• Tabl e 5, “Absolute Maximum Ratings,” on page 9: Updated table.
• Tabl e 6, “Recommended Operating Conditions,” on page 9: Updated table.
• Figure 5: “152-Ball Functional Block Diagram (Single LPDDR),” on page 10: Updated
figure title; updated figure.
• Figure 6: “152-Ball Functional Block Diagram (Dual LPDDR),” on page 11: Added fig-
ure.
Rev. D, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/08
• Updated template; ready for external publication.
Rev. C, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8/08
• Added part number for JQ package code, page 1.
•Figure 2, Marketing Part Number Example, on page 2: added JQ package code.
• Added JQ package diagram, Figure 9, 152-Ball TFBGA (Package Code: JQ), on page 14.
Rev. B, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/08
•On page 1, added part number for CA package code.
•Figure 2: Marketing Part Number Example on page 2: Added CA package code.
• Removed former capacitance tables. See component data sheets for capacitance.
• Figure 7: 152-Ball VFBGA (Package Code: CA) on page 12, and Figure 8: 152-Ball
VFBGA (Package Code: CG) on page 13: Updated figures.
Rev. A, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/08
•Initial release.
