X28HC64JIZ-90 Datasheet X28HC64JIZ-90, X28HC64J-90, X28HC64D-90 | P16-P18

X28HC64

FN8109.4

June 27, 2016

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Plastic Leaded Chip Carrier Packages (PLCC)

SEATING

PLANE

0.015 (0.38)

MIN

VIEW “A”

D2/E2

0.025 (0.64)

0.045 (1.14)

0.042 (1.07)

0.056 (1.42)

0.050 (1.27) TP

PIN (1)

0.020 (0.51) MAX

3 PLCS

0.026 (0.66)

0.032 (0.81)

0.050 (1.27)

MIN

0.013 (0.33)

0.021 (0.53)

0.025 (0.64)

MIN

VIEW “A” TYP.

0.004 (0.10) C

-C-

D2/E2

IDENTIFIER

(0.12)

- B SAS

0.042 (1.07)

0.048 (1.22)

0.005

N32.45x55 (JEDEC MS-016AE ISSUE A)

32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.125 0.140 3.18 3.55 -

A1 0.060 0.095 1.53 2.41 -

D 0.485 0.495 12.32 12.57 -

D1 0.447 0.453 11.36 11.50 3

D2 0.188 0.223 4.78 5.66 4, 5

E 0.585 0.595 14.86 15.11 -

E1 0.547 0.553 13.90 14.04 3

E2 0.238 0.273 6.05 6.93 4, 5

N28 286

ND 7 7 7

NE 9 9 7

Rev. 0 7/98

NOTES:

1. Controlling dimension: INCH. Converted millimeter

dimensions are not necessarily exact.

2. Dimensions and tolerancing per ANSI Y14.5M-1982.

3. Dimensions D1 and E1 do not include mold protrusions.

Allowable mold protrusion is 0.010 inch (0.25mm) per side.

Dimensions D1 and E1 include mold mismatch and are

measured at the extreme material condition at the body

parting line.

4. To be measured at seating plane contact point.

5. Centerline to be determined where center leads exit plastic

body.

6. “N” is the number of terminal positions.

7. ND denotes the number of leads on the two shorts sides of the

package, one of which contains pin #1. NE denotes the

number of leads on the two long sides of the package.

-C-

X28HC64

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Small Outline Plastic Packages (SOIC)

INDEX

AREA

123

-B-

0.25(0.010) C AM BS

-A-

-C-

SEATING PLANE

0.10(0.004)

h x 45o

0.25(0.010) BM M

(1.50mm)

(9.38mm)

(1.27mm TYP)

(0.51mm TYP)

TYPICAL RECOMMENDED LAND PATTERN

M28.3 (JEDEC MS-013-AE ISSUE C)

28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.0926 0.1043 2.35 2.65 -

A1 0.0040 0.0118 0.10 0.30 -

B 0.013 0.0200 0.33 0.51 9

C 0.0091 0.0125 0.23 0.32 -

D 0.6969 0.7125 17.70 18.10 3

E 0.2914 0.2992 7.40 7.60 4

e 0.05 BSC 1.27 BSC -

0.394 0.419 10.00 10.65 -

0.01 0.029 0.25 0.75 5

L 0.016 0.050 0.40 1.27 6

N28 287

 0

Rev. 1, 1/13

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm (0.024

inch)

10. Controlling dimension: MILLIMETER. Converted inch dimensions are

not necessarily exact.

X28HC64

Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted

in the quality certifications found at www.intersil.com/en/support/qualandreliability.html

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time

without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be

accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third

parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

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Dual-In-Line Plastic Packages (PDIP)

NOTES:

1. Controlling Dimensions: INCH. In case of conflict between English and

Metric dimensions, the inch dimensions control.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication No. 95.

4. Dimensions A, A1 and L are measured with the package seated in JEDEC

seating plane gauge GS-3.

5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold

flash or protrusions shall not exceed 0.010 inch (0.25mm).

6. E and are measured with the leads constrained to be

perpendicular to datum .

7. e

and e

are measured at the lead tips with the leads unconstrained. e

must be zero or greater.

8. B1 maximum dimensions do not include dambar protrusions. Dambar

protrusions shall not exceed 0.010 inch (0.25mm).

9. N is the maximum number of terminal positions.

10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,

E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).

-C-

-B-

INDEX

12 3 N/2

AREA

SEATING

BASE

PLANE

-C-

-A-

0.010 (0.25) C AM BS

E28.6 (JEDEC MS-011-AB ISSUE B)

28 LEAD DUAL-IN-LINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A-0.250 - 6.35 4

A1 0.015 - 0.39 -4

A2 0.125 0.195 3.18 4.95 -

B 0.014 0.022 0.356 0.558 -

B1 0.030 0.070 0.77 1.77 8

C 0.008 0.015 0.204 0.381 -

D 1.380 1.565 35.1 39.7 5

D1 0.005 - 0.13 -5

E 0.600 0.625 15.24 15.87 6

E1 0.485 0.580 12.32 14.73 5

e 0.100 BSC 2.54 BSC -

0.600 BSC 15.24 BSC 6

- 0.700 - 17.78 7

L 0.115 0.200 2.93 5.08 4

N28 289

Rev. 1 12/00

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18

X28HC64JIZ-90

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Manufacturer:

Renesas / Intersil

Description:

EEPROM 8K X 8 EEPROM CMOS 3

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