Electrical Specifications
Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other condi-
tions outside those indicated in each device's data sheet is not implied. Exposure to ab-
solute maximum rating conditions for extended periods may adversely affect reliability.
Table 9: Absolute Maximum Ratings
Symbol Parameter Min Max Units Notes
V
DD
V
DD
supply voltage relative to V
SS
–0.4 1.5 V 1
V
DDQ
V
DDQ
supply voltage relative to V
SS
–0.4 1.5 V 1
V
PP
Voltage on V
PP
pin relative to V
SS
–0.4 3.0 V 2
V
IN
, V
OUT
Voltage on any pin relative to V
SS
–0.4 1.5 V
Table 10: Operating Conditions
Symbol Parameter Min Nom Max Units Notes
V
DD
V
DD
supply voltage 1.14 1.2 1.26 V 1
V
PP
DRAM activating power supply 2.375 2.5 2.75 V 2
V
REFCA(DC)
Input reference voltage command/
address bus
0.49 × V
DD
0.5 × V
DD
0.51 × V
DD
V 3
I
VTT
Termination reference current from V
TT
–500 – 500 mA
V
TT
Termination reference voltage (DC) –
command/address bus
0.49 × V
DD
-
20mV
0.5 × V
DD
0.51 × V
DD
+
20mV
V 4
I
IN
Input leakage current; any input excluding ZQ;
0V < V
IN
< 1.1V
–2.0 – 2.0 µA 5
I
I/O
DQ leakage; 0V < V
in
< V
DD
–4.0 – 4.0 µA 5
I
ZQ
Input leakage current; ZQ –3.0 – 3.0 µA 5, 6
I
OZpd
Output leakage current; V
OUT
= V
DD
; DQ is disabled – – 5.0 µA
I
OZpu
Output leakage current; V
OUT
=V
SS
; DQ and ODT are
disabled; ODT is disabled with ODT input HIGH
– – 5.0 µA
I
VREFCA
V
REFCA
leakage; V
REFCA
= V
DD
/2 (after DRAM is ini-
tialized)
–2.0 – 2.0 µA 5
Notes:
1. V
DDQ
tracks with V
DD
; V
DDQ
and V
DD
are tied together.
2. V
PP
must be greater than or equal to V
DD
at all times.
3. V
REFCA
must not be greater than 0.6 x V
DD
. When V
DD
is less than 500mV, V
REF
may be
less than or equal to 300mV.
4. V
TT
termination voltages in excess of the specification limit adversely affect the voltage
margins of command and address signals and reduce timing margins.
5. Multiply by the number of DRAM die on the module.
6. Tied to ground. Not connected to edge connector.
8GB (x64, SR) 260-Pin DDR4 SODIMM
Electrical Specifications
CCMTD-1725822587-9885
atf8c1gx64hz.pdf – Rev. F 9/16 EN
13
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© 2015 Micron Technology, Inc. All rights reserved.
