Figure 6: 78-Ball FBGA Die Rev. E (package code TRF)
Seating plane
0.12 A
123789
Ball A1 Index
(covered by SR)
Ball A1 Index
A
0.25 MIN
1.1 ±0.1
6.4 CTR
9.5 ±0.1
0.8 TYP
9.6 CTR
11.5 ±0.1
78X Ø0.45
Dimensions apply
to solder balls
post-reflow
on Ø0.33 NSMD
ball pads.
0.8 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
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Micron and the Micron logo are trademarks of Micron Technology, Inc. TwinDie is a trademark of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
8Gb: x4, x8 TwinDie DDR3L SDRAM
Package Dimensions
PDF: 09005aef84787542
DDR3L_8Gb_x4_x8_2CS_TwinDie.pdf - Rev. F 05/13 EN
13
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