LTC4371
7
4371f
For more information www.linear.com/LTC4371
operaTion
The LTC4371 controls N-channel MOSFETs to emulate two
ideal diodes (see Block Diagram). By sensing the MOSFETs
source-to-drain voltage drop, amplifiers AMPA and AMPB
control the gate of their respective external MOSFET to act
as an ideal diode with a 15mV forward (∆V
SD
) drop. With
low load currents, the amplifier regulates the MOSFET gate
near its threshold to maintain a forward drop of 15mV. As
load current increases, the gate voltage is driven higher
to maintain a drop of 15mV. For very large load currents
where the MOSFET gate is driven fully on, the forward drop
rises linearly with current according to R
DS(ON)
I
LOAD
. If
the forward drop is less than 15mV, or if ∆V
SD
reverses,
the amplifier turns the MOSFET off and the load current
transfers to the other channel.
When the power supply voltages are nearly equal, this
regulation technique ensures that the load current is
smoothly shared between the supplies without oscilla
-
tion. The current balance depends on the R
DS(ON)
of the
MOSFETs and the output resistance of the supplies.
In the case of supply failure, such as supply V
A
, while
conducting most or all of the load current is shorted to
return, a large reverse current flows from return through
M1 to any load capacitance and through M2 to supplyV
B
.
AMPA detects the current reversal and turns off M1 in less
than 220ns. Fast turn-off prevents reverse current from
rising to a damaging level.
The remaining supply V
B
delivers load current through
the body diode of M2, until the gate is driven on. With
700mV forward drop across M2, AMPB responds quickly
and drives the gate with 5mA pull-up current, limiting
the body diode conduction time to under 100μs. This
minimizes power dissipation arising from switchover and
is especially important in 60Hz AC applications. As the
forward drop reduces, a weaker output stage takes over
and regulates the forward drop, within the limitations of
R
DS(ON)
, to 15mV.
The LTC4371 can be powered in –4.5V to –16V applica-
tions by connecting V
DD
directly to the power supply
return. In higher voltage applications or to guard against
input transients, V
Z
and V
DD
can be connected together
and powered from return through a bias resistor, R
Z
. For
repetitive 5mA gate pull-up current, V
DD
can be driven
by a buffer biased by V
Z
. The V
Z
pin is shunt regulated to
12.4V with respect to V
SS
with 50μA minimum bias, and
is capable of sinking up to 10mA.
The LTC4371 is designed to withstand high voltage tran
-
sients exceeding ±300V, such as those experienced during
lightning-induced surges and input supply short circuit
events, without damage. 130V internal clamps protect
drain pins DA and DB against positive spikes. External
resistors R
DA
and R
DB
are necessary to limit the peak
clamp current to less than 10mA.
In an application circuit, negative spikes are clamped by
the MOSFETs body diode to V
OUT
, such that the drain
pin never sees more than –700mV with respect to V
SS
. A
safely clamped negative transient on one input manifests
itself as a positive transient on the second input and as
an increased voltage from RTN to V
OUT
. The bias resistor,
R
Z
, limits the current into the V
Z
shunt regulator to less
than 10mA.
A Fault Detection circuit monitors MOSFET ∆V
SD
; FAULTB
pulls low if ∆V
SD
of either channel exceeds 200mV while
the gate is driven fully on. This is an indication of an open
circuit MOSFET and can be configured for fuse monitor
-
ing by moving the drain pin connection to the input side
of the fuse.
LTC4371
8
4371f
For more information www.linear.com/LTC4371
applicaTions inForMaTion
Figure 1. –36V to –72V/25A Ideal Diode-OR Controller
Figure 2. Simplest Solution: V
DD
Connected Directly to V
Z
4371 F01
LTC4371
DA DB GA GB SA
V
Z
V
DD
SB V
SS
C1
2.2μF
R
DA
20k
R
DB
20k
M1
IPT020N10N3
M2
IPT020N10N3
V
A
–36V TO
–72V
V
B
–36V TO
–72V
V
OUT
25A LOAD
D1
GREEN LED
R
Z
30k
R1
33k
RTN
FAULTB
LTC4371
V
Z
V
DD
V
SS
C1
2.2μF
R
Z
RT N
V
OUT
4371 F02
High availability systems employ parallel connected power
supplies or battery feeds to achieve redundancy and
enhance system reliability. Schottky diodes are a popular
means of ORing these supplies together at the point of load.
The chief disadvantage of Schottky diodes is their sig
-
nificant forward voltage drop and resulting power and
efficiency loss. This drop reduces the available supply
voltage and dissipates significant power
. The
LTC4371
solves these problems by using an N-channel MOSFET
as a low loss pass element to emulate the behavior of a
diode (see Figure1).
The MOSFET is turned on when power passes in the
forward direction (positive current flow from source to
drain), allowing for a low voltage drop from load to sup
-
ply. In the reverse direction, the MOSFET is turned off to
block current flow. By these means, the MOSFET is made
to approach the function and per
formance of an ideal
diode. The MOSFET voltage drop, ∆V
SD
, is sensed by the
DA and SA, or DB and SB pins.
Powering V
DD
The LTC4371 is fundamentally a low voltage device op-
erating over a range of 4.5V to 16V at the V
DD
pin, with
respect to V
SS
. The gate amplifiers are powered from the
V
DD
pin and pull-up to within 300mV of V
DD
.
In low voltage applications such as –5V or –12V, the V
DD
pin can be powered directly from return, with V
SS
con-
nected to V
OUT
.
An internal 12.4V shunt regulator at the V
Z
pin provides
a means of operating the LTC4371 from higher voltage
supplies. It regulates over a range of 50μA to 10mA. In the
simplest configuration shown in Figure2, V
DD
is connected
directly to V
Z
and biased by resistor R
Z
from the return.
A 2.2μF decoupling capacitor is required to stabilize the
V
Z
shunt regulator, and to momentarily provide the 5mA
fast pull-up current at the gate pins as needed.
Bias resistor R
Z
is chosen to bias the shunt regulator
and provide the maximum V
DD
current at the expected
minimum input voltage according to:
R
Z
<
V
IN(MIN)
V
Z(MIN)
I
DD(MAX)
+ 50µA
(1)
Maximum bias resistor dissipation is calculated from:
P
D(RZ)
=
(V
IN(MAX)
V
Z(MIN)
)
2
R
Z
(2)
The maximum shunt regulator current must not exceed
10mA such that:
R
Z
>
V
IN(MAX)
V
Z(MIN)
10mA
(3)
In –48V applications a single 1206 size 30kΩ resistor is
adequate to power the LTC4371. In the application shown
in Figure 1, at 100V (a commonly specified maximum
transient condition) peak dissipation in R
Z
just exceeds
250mW, while the maximum V
Z
current is slightly less
than 3mA.
Dissipation rises in certain applications so that a larger
package or multiple series units are necessary to imple
-
ment R
Z
. Examples include AC applications where the
gate drivers demand additional current to supply repetitive
LTC4371
9
4371f
For more information www.linear.com/LTC4371
applicaTions inForMaTion
Figure 4. MOSFET Cascode for High Voltage >250V
Applications with 5mA Gate Pull-Up Current
Figure 3. V
DD
Connected to V
Z
with NPN for Repetitive
5mA Gate Pull-Up Current
LTC4371
V
Z
V
DD
V
SS
C1
0.1μF
R
Z
RTN
V
OUT
Q1
4371 F03
4371 F04
LTC4371
V
Z
V
DD
V
SS
C1
0.1μF
R
Z1
R
Z2
R
G
10Ω
RTN
V
OUT
Q1
2N3904
M1
BSP125 (600V)
pulses from the 5mA fast pull-up, applications where the
input operating voltage exceeds 72V and applications with
a wide range of input voltage, particularly those where the
minimum input voltage approaches the operating voltage
of the LTC4371. A wide input voltage range may also result
in a situation where the maximum V
Z
current calculated
in Equation 3 exceeds 10mA. For these cases an NPN
transistor can be used to buffer the shunt regulator and
power V
DD
, as shown in Figure3. Equation 1 becomes:
R
Z
<
V
IN(MIN)
V
Z(MIN)
50µA +
I
DD(MAX)
β
(4)
R
Z
(or R
Z2
) may be split into multiple segments in order
to achieve the desired standoff voltage or dissipation.
Whereas 1206 size resistors are commonly rated for 200V
working and 400V peak, pad spacing and circuit board de
-
sign rules may limit the working rating to as little as 100V.
In Figure
3, the voltage drop and power dissipation of Q1
may be augmented by the use of one or more resistors
in series with the collector. The same applies for M1 in
Figure4.
For all applications R
Z
(or R
Z1
+ R
Z2
) must limit the maxi-
mum V
Z
current to less than 10mA, as calculated using
Equation 3. If voltage transients are anticipated, V
IN(MAX)
becomes the peak transient voltage. Transient require-
ments may force the use of Figure3 or Figure4 instead
of Figure
2.
The peak V
Z
current may also be reduced
to less than 10mA by filtering, e.g. split R
Z
(or R
Z2
) into
two equal parts and connect a bypass capacitor from the
central node to V
SS
.
Strong Gate Pull-Up
For fast turn-on, a strong 5mA driver pulls up on the gate
when the MOSFET forward drop (∆V
SD
) is large. In simple
shunt-regulated applications such as shown in Figure2,
the bias resistor R
Z
may be incapable of supplying 5mA.
In this case, a 2.2µF bypass capacitor is required to
momentarily provide the strong pull-up current to fully
charge the MOSFET gate. In normal operation the 5mA
drive is not a DC condition, as it flows only long enough
to deliver gate charge to the MOSFET. The amount of
where 50μA represents the minimum V
Z
shunt regulator
operating current and β is Q1’s DC current gain.
The maximum power dissipation in R
Z
and the maximum
V
Z
current are calculated from Equations 2 and 3. Dissipa-
tion in emitter follower Q1 is given by:
P
D(Q1)
=
(V
IN(MAX)
+
V
BE
V
Z(MIN)
)I
DD(MAX)
(5)
In buffered applications, bypass V
Z
with a 100nF capacitor
to V
SS
. Bypassing V
DD
is unnecessary.
For applications at very high voltages, beyond 300V, small
high voltage MOSFETs are more readily available than
bipolar devices and the circuit of Figure4 is preferred.
R
Z
, calculated using Equation 4, is split into two parts,
R
Z1
and R
Z2
. R
Z1
is sized to produce a 3V drop when
operating at V
IN(MIN)
.

LTC4371CMS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Power Management Specialized - PMIC 2x Neg V Ideal Diode-OR Cntr & Mon
Lifecycle:
New from this manufacturer.
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