NOVEMBER 1997 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Recommended Printed Wiring Footprint
Device Symbolization Code
MECHANICAL DATA
Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified.
Devices are shipped in one of the carriers below. Unless a specific method of shipment is specified by the customer, devices will be shipped in
the most practical carrier. For production quantities, the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk
pack or embossed tape.
Carrier Information
TISP4xxxH3BJ Overvoltage Protector Series
SMB Pad Size
MDXXBI
METRIC
(INCHES)
DIMENSIONS ARE:
2.54
(0.10)
2.40
(0.09)
2.16
(0.09)
Carrier
Order As
Embossed Tape Reeled
Bulk Pack
TISP4xxxH3BJR-S
TISP4xxxH3BJ-S
Device
Symbolization
Code
TISP4070H3BJ 4070H3
TISP4080H3BJ 4080H3
TISP4095H3BJ 4095H3
TISP4115H3BJ 4115H3
TISP4125H3BJ 4125H3
TISP4145H3BJ 4145H3
TISP4165H3BJ 4165H3
TISP4180H3BJ 4180H3
TISP4200H3BJ 4200H3
TISP4220H3BJ 4220H3
TISP4240H3BJ 4240H3
TISP4250H3BJ 4250H3
TISP4265H3BJ 4265H3
TISP4290H3BJ 4290H3
TISP4300H3BJ 4300H3
TISP4350H3BJ 4350H3
TISP4395H3BJ 4395H3
TISP4400H3BJ 4400H3
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
