LTC4440
6
4440fb
For more information www.linear.com/LTC4440
PIN FUNCTIONS
V
CC
(Pin 1): Chip Supply. This pin powers the internal
low side circuitry. A low ESR ceramic bypass capacitor
should be tied between this pin and the GND pin (Pin 2).
GND (Pin 2): Chip Ground.
INP (Pin 3): Input Signal. TTL/CMOS compatible input
referenced to GND (Pin 2).
TS (Pin 4): Top (High Side) Source Connection.
TG (Pin 5): High Current Gate Driver Output (Top Gate).
This pin swings between TS and BOOST.
BOOST (Pin 6): High Side Bootstrapped Supply. An
external capacitor should be tied between this pin and
TS (Pin 4). Normally, a bootstrap diode is connected
between V
CC
(Pin1) and this pin. Voltage swing at this
pin is from V
CC
– V
D
to V
IN
+ V
CC
– V
D
, where V
D
is the
forward voltage drop of the bootstrap diode.
SOT-23 Package
INP (Pin 1): Input Signal. TTL/CMOS compatible input
referenced to GND (Pin 2).
GND (Pins 2, 4): Chip Ground.
V
CC
(Pin 3): Chip Supply. This pin powers the internal
low side circuitry. A low ESR ceramic bypass capacitor
should be tied between this pin and the GND pin (Pin 2).
NC (Pin 5): No Connect. No connection required. For
convenience, this pin may be tied to Pin 6 (BOOST) on
the application board
.
BO
OST (Pin 6): High Side Bootstrapped Supply. An external
capacitor should be tied between this pin and TS (Pin8).
Normally, a bootstrap diode is connected between V
CC
(Pin3) and this pin. Voltage swing at this pin is from V
CC
– V
D
to V
IN
+ V
CC
– V
D
, where V
D
is the forward voltage
drop of the bootstrap diode.
TG (Pin 7): High Current Gate Driver Output (Top Gate).
This pin swings between TS and BOOST.
TS (Pin 8): Top (High Side) Source Connection.
Exposed Pad (Pin 9): Ground. Must be electrically con
-
nected to Pins 2 and 4 and soldered to PCB ground for
optimum thermal performance.
Exposed Pad MS8E Package