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SST39WF1601-70-4I-MAQE-T

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P35
©2013 Silicon Storage Technology, Inc. DS-20005014B 11/2013
31
16 Mbit Multi-Purpose Flash Plus
SST39WF1601 / SST39WF1602
Data Sheet
Product Ordering Information
SST 39 WF 1601 - 70 - 4C - B3KE - MQ1
XX XX XXXX - XX - XX - XXXX - XXX
Automotive Grade Indicator
blank = standard parts
MQ1/MQ2 = Automotive Grade 3
Environmental Attribute
E
1
= non-Pb
Package Modifier
K = 48 balls
Q = 48 balls (66 possible positions)
Package Type
B3 = TFBGA (6mm x 8mm)
MB = WFBGA (5mm x 6mm)
MA = WFBGA (4mm x 6mm)
Temperature Range
C = Commercial = 0°C to +70°C
I = Industrial = -40°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Read Access Speed
70=70ns
Hardware Block Protection
1 = Bottom Boot-Block
2 = Top Boot-Block
Device Density
160 = 16 Mbit
Voltage
W = 1.65-1.95V
Product Series
39 = Multi-Purpose Flash
1. Environmental suffix “E” denotes non-Pb sol-
der. Non-Pb solder devices are “RoHS Com-
pliant”.
©2013 Silicon Storage Technology, Inc. DS-20005014B 11/2013
32
16 Mbit Multi-Purpose Flash Plus
SST39WF1601 / SST39WF1602
Data Sheet
Valid Combinations for SST39WF1601
SST39WF1601-70-4C-B3KE SST39WF1601-70-4C-MAQE
SST39WF1601-70-4I-B3KE SST39WF1601-70-4I-MAQE
Valid Combinations for SST39WF1602
SST39WF1602-70-4C-B3KE SST39WF1602-70-4C-MAQE
SST39WF1602-70-4I-B3KE SST39WF1602-70-4I-MAQE
Valid Combinations for Automotive Grade 3
SST39WF1601-70-4I-B3KE-MQ1
SST39WF1602-70-4I-B3KE-MQ2
Note:Automotive-qualified devices are only available in the B3KE package. Qualification and characterization are
performed according to the Automotive Electronics Council’s requirement AEC-Q100, Revision G.
Note:Valid combinations are those products in mass production or will be in mass production. Consult your Micro-
chip sales representative to confirm availability of valid combinations and to determine availability of new
combinations.
©2013 Silicon Storage Technology, Inc. DS-20005014B 11/2013
33
16 Mbit Multi-Purpose Flash Plus
SST39WF1601 / SST39WF1602
Data Sheet
Packaging Diagrams
Figure 25:48-ball Thin-Profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm
Package Code: B3K
A1 CORNER
H G F E D C B A
A B C D E F G H
BOTTOM VIEWTOP VIEW
SIDE VIEW
6
5
4
3
2
1
6
5
4
3
2
1
SEATING PLANE
0.35 ± 0.05
1.10 ± 0.10
0.12
6.00 ± 0.10
0.45 ± 0.05
(48X)
A1 CORNER
8.00 ± 0.10
0.80
4.00
0.80
5.60
48-tfbga-B3K-6x8-450mic-5
Note: 1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
1mm
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P35

SST39WF1601-70-4I-MAQE-T

Mfr. #:
Buy SST39WF1601-70-4I-MAQE-T
Manufacturer:
Microchip Technology
Description:
NOR Flash 1.65V to 1.95V 16Mbit Multi-Prps Fl
Lifecycle:
New from this manufacturer.
Delivery:
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