XC18V00 Series In-System Programmable Configuration PROMs
DS026 (v3.9) November 18, 2002 www.xilinx.com 13
Product Specification 1-800-255-7778
R
Reset Activation
On power up, OE/RESET is held low until the XC18V00 is
active (1 ms). OE/RESET
is connected to an external resis-
tor to pull OE/RESET
HIGH releasing the FPGA INIT and
allowing configuration to begin. If the power drops below
2.0V, the PROM resets. OE/RESET
polarity is not program-
mable. See Figure 8 for power-up requirements.
Standby Mode
The PROM enters a low-power standby mode whenever CE
is asserted High. The address is reset. The output remains
in a high-impedance state regardless of the state of the OE
input. JTAG pins TMS, TDI and TDO can be in a
high-impedance state or High.
5V Tolerant I/Os
The I/Os on each re-programmable PROM are fully 5V tol-
erant even through the core power supply is 3.3V. This
allows 5V CMOS signals to connect directly to the PROM
inputs without damage. In addition, the 3.3V V
CC
power
supply can be applied before or after 5V signals are applied
to the I/Os. In mixed 5V/3.3V/2.5V systems, the user pins,
the core power supply (V
CC
), and the output power supply
(V
CCO
) can have power applied in any order. This makes
the PROM devices immune to power supply sequencing
issues.
Customer Control Bits
The XC18V00 PROMs have various control bits accessible
by the customer. These can be set after the array has been
programmed using Skip User Array in Xilinx iMPACT soft-
ware. See Table 7.
Figure 8: V
CC
Power-Up Requirements
Time (ms)
Volts
3.6V
3.0V
0V
Recommended Operating Range
Recommended
V
CC
Rise
Time
1ms 50ms0ms
ds026_10_032702
Table 7: Truth Table for PROM Control Inputs
Control Inputs
Internal Address
Outputs
OE/RESET CE DATA CEO I
CC
High Low If address < TC
(1)
: increment
If address > TC
(1)
: dont change
Active
High-Z
High
Low
Active
Reduced
Low Low Held reset High-Z High Active
High High Held reset High-Z High Standby
Low High Held reset High-Z High Standby
Notes:
1. TC = Terminal Count = highest address value. TC + 1 = address 0.
XC18V00 Series In-System Programmable Configuration PROMs
14 www.xilinx.com DS026 (v3.9) November 18, 2002
1-800-255-7778 Product Specification
R
Absolute Maximum Ratings
(1,2)
Recommended Operating Conditions
Quality and Reliability Characteristics
DC Characteristics Over Operating Conditions
Symbol Description Value Units
V
CC
Supply voltage relative to GND 0.5 to +4.0 V
V
IN
Input voltage with respect to GND 0.5 to +5.5 V
V
TS
Voltage applied to High-Z output 0.5 to +5.5 V
T
STG
Storage temperature (ambient) 65 to +150 °C
T
SOL
Maximum soldering temperature (10s @ 1/16 in.) +260 °C
T
J
Junction temperature +150 °C
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins can undershoot to 2.0V or overshoot to +7.0V, provided this over- or undershoot lasts less then 10 ns and with the
forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
Symbol Parameter Min Max Units
V
CCINT
Internal voltage supply (T
A
= 0°C to +70°C) Commercial 3.0 3.6 V
Internal voltage supply (T
A
= 40°C to +85°C) Industrial 3.0 3.6 V
V
CCO
Supply voltage for output drivers for 3.3V operation 3.0 3.6 V
Supply voltage for output drivers for 2.5V operation 2.3 2.7 V
V
IL
Low-level input voltage 0 0.8 V
V
IH
High-level input voltage 2.0 5.5 V
V
O
Output voltage 0 V
CCO
V
T
VCC
V
CC
rise time from 0V to nominal voltage
(1)
150ms
Notes:
1. At power up, the device requires the V
CC
power supply to monotonically rise from 0V to nominal voltage within the specified V
CC
rise
time. If the power supply cannot meet this requirement, then the device might not perform power-on-reset properly. See Figure 8.
Symbol Description Min Max Units
T
DR
Data retention 20 - Years
N
PE
Program/erase cycles (Endurance) 20,000 - Cycles
V
ESD
Electrostatic discharge (ESD) 2,000 - Volts
Symbol Parameter Test Conditions Min Max Units
V
OH
High-level output voltage for 3.3V outputs I
OH
= 4 mA 2.4 - V
High-level output voltage for 2.5V outputs I
OH
= 500 µA 90% V
CCO
-V
XC18V00 Series In-System Programmable Configuration PROMs
DS026 (v3.9) November 18, 2002 www.xilinx.com 15
Product Specification 1-800-255-7778
R
V
OL
Low-level output voltage for 3.3V outputs I
OL
= 8 mA - 0.4 V
Low-level output voltage for 2.5V outputs I
OL
= 500 µA-0.4V
I
CC
Supply current, active mode 25 MHz - 25 mA
I
CCS
Supply current, standby mode - 10 mA
I
ILJ
JTAG pins TMS, TDI, and TDO V
CC =
MAX
V
IN
= GND
100 - µA
I
IL
Input leakage current V
CC
= Max
V
IN
= GND or V
CC
10 10 µA
I
IH
Input and output High-Z leakage current V
CC
= Max
V
IN
= GND or V
CC
10 10 µA
C
IN
and
C
OUT
Input and output capacitance V
IN
= GND
f = 1.0 MHz
-10pF
Symbol Parameter Test Conditions Min Max Units

XC18V256PC20C

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