MAX14677DEMBD#

MAXIM PRODUCT NAMING CONVENTIONS
Product Numbers for Proprietary Parts
Most Maxim parts use our own part numbering system which consists of a base part
number followed by a suffix, plus optional additional designators.
Example:
(A) Base Part Number
The base part number identifies the product type, independent of package,
temperature, and other variants. Variants such as accuracy grade are usually denoted
in the suffix but sometime a variant will be assigned a new base part number.
(B) Suffix
Maxim parts have a three or four letter suffix.
Four letter suffix
When a part has a four-letter suffix, the first letter of the suffix denotes product
grade (accuracy, speed, etc.) For example, the first "A" in MAX631ACPA
indicates 5% output accuracy. The product's full data sheet details the grades
that apply to that part. The remaining three letters conform to the rules for three-
letter suffixes.
Three-letter suffix
The three letters denote temperature range, package type, and number of pins.
The meanings are defined in the tables below.
Example: MAX696CWE
C = Operating Temperature Range C (0°C to +70°C)
W = Package Type W (SOIC 0.300")
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E = Number of Pins category E (16 pins)
Please note that suffix codes are not always consistent across different product
types. Always refer to the data sheet for details and specifications.
Temperature Ranges
A Automotive AEC-Q100 Grade
1
-40°C to +125°C
C Commercial 0°C to +70°C
E Extended -40°C to +85°C
G Automotive AEC-Q100 Grade
2
-40°C to +105°C
I Industrial -20°C to +85°C
M Military -55°C to +125°C
T Automotive AEC-Q100 Grade
0
-40°C to +150°C
U Upper Commercial 0°C to +85°C
Package Type
A SSOP (Shrink Small Outline Package) 209 mil (14, 16, 20, 24, 28 leads); 300 mil
(36 leads)
B UCSP (Ultra-Small Chip Scale Pkg)
C PLASTIC TO-92; TO-220
C LQFP 1.4mm (7mm x 7mm thru 20mm x 20mm)
C TQFP 1.0mm (7mm x 7mm thru 20mm x 20mm)
D CERAMIC SIDEBRAZE 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40, 48
leads)
E QSOP (Quarter Small Outline Package)
F CERAMIC FLATPACK
G METAL CAN (Gold)
G QFN (Plastic, Very Thin, Quad Flat No Lead - Punch Version) 0.9mm
H SBGA (Super Ball Grid Array)
H TQFP 1.0mm 5mm x 5mm (32 leads)
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H TSSOP (Thin Shrink Small Outline Package) 4.4mm (8 leads)
J CERDIP (Ceramic Dual-Inline) (N) 300 mil (8, 14, 16, 18, 20 leads); (W) 600 mil
(24, 28, 40 leads)
K SOT 1.23mm (8 Leads)
L LCC (Leadless Ceramic Chip Carrier) (18, 20, 28 leads)
L FCLGA (Flip Chip Land Grid Array); THIN LGA (Thin Land Grid Array) 0.8mm
L µDFN (Micro Dual Flat No Lead) (6, 8, 10 leads)
M MQFP (Metric Quad Flat Pack) over 1.4mm; ED-QUAD (28mm x 28mm 160
leads)
N PDIP (Narrow Plastic Dual-Inline) 300 mil (24, 28 leads)
P PDIP (Plastic Dual-Inline) 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40
leads)
Q PLCC (Plastic Leaded Chip Carrier)
R CERDIP (Narrow Ceramic Dual-Inline) 300 mil (24, 28 leads)
S SOIC (Narrow Plastic Small Outline) 150 mil
T METAL CAN (Nickel)
T TDFN (Plastic, Very Very Thin, Dual Flat No Lead - Sawn Version) 0.9mm (6, 8,
10, 14 leads)
T THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
TQ THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
(8 leads)
U SOT 1.23mm (3, 4, 5, 6 leads)
U TSSOP (Thin Shrink Small Outline Package) 4.4mm (14, 16, 20, 24, 28, 38, 56
leads); 6.1mm (48 leads)
U µMAX (Thin Shrink Small Outline Package) 3mm x 3mm (8, 10 leads)
V U. TQFN (Ultra Thin QFN -Plastic Ultra Thin Quad Flat No Lead - Sawn version)
0.55mm
W SOIC (Wide Plastic Small Outline) 300 mil
W WLP (Wafer Level Pkg)
X CSBGA 1.4mm
X CVBGA 1.0mm
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MAX14677DEMBD#

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Motor / Motion / Ignition Controllers & Drivers Demo board for Integrated High-Efficiency Voice Coil Motor Driver and Fixed-Frequency DC-DC Converter
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union