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PS2733-1-F3-A

P1-P3P4-P6P7-P9P10-P12P13-P13
Data Sheet PN10248EJ02V0DS
7
PS2732-1,PS2733-1
25
1.2
1.0
0.8
0.6
0.4
0.2
–50 0–25 50 75
100
5 000
0
V
CE = 2 V
0.1
300
20
V
CC = 10 V,
I
C = 10 mA
Normalized to 1.0
at T
A = 25 ˚C,
IF = 1 mA, VCE = 2 V
0.01
V
CE = 4 V,
I
C = 10 mA,
V
in = 0.1 Vp-p
–25
–15
–10
–5
0
4 000
3 000
2 000
1 000
Sample B
Sample A
0.5 1 5 10 20
100
50
10
1
5
50 100 500 1 k
2 k
tr
td
tf
ts
–30
–20
0.1 1 10 100
V
in
F
µ
1
47
Ω
1 kΩ
V
out
100 Ω
1 kΩ
0
R
L
1.2
1.0
0.8
0.6
0.4
0.2
0
10
10
2
10
3
10
4
10
5
10
6
IF = 1 mA
T
A = 25 ˚C
T
A = 60 ˚C
Forward Current I
F (mA)
Ambient Temperature T
A (˚C)
Load Resistance R
L (Ω)
Frequency f (kHz)
Normalized Current Transfer Ratio CTR
Current Transfer Ratio CTR (%)
Normalized Gain G
V
Switching Time t ( s)
µ
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
LONG TERM CTR DEGRADATION
Time (Hr)
CTR (Relative Value)
RL = 10 Ω
Remark The graphs indicate nominal characteristics.
Data Sheet PN10248EJ02V0DS
8
PS2732-1,PS2733-1
TAPING SPECIFICATIONS (in millimeters)
Tape Direction
Outline and Dimensions (Reel)
Packing: 3 500 pcs/reel
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
330±2.0
φ
100±1.0
φ
2.0±0.5
11.9 to 15.4
Outer edge of
flange
17.5±1.0
13.5±1.0
13.0±0.2
φ
PS2732-1-F3
PS2733-1-F3
PS2732-1-F4
PS2733-1-F4
1.55±0.1
2.0±0.05
4.0±0.1
1.75±0.1
4.6±0.1
2.9 MAX.
0.3
8.0±0.1
Outline and Dimensions (Tape)
2.4±0.1
1.5
+0.1
–0
7.4±0.1
5.5±0.05
12.0±0.2
Data Sheet PN10248EJ02V0DS
9
PS2732-1,PS2733-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260°C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220°C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
P1-P3P4-P6P7-P9P10-P12P13-P13

PS2733-1-F3-A

Mfr. #:
Buy PS2733-1-F3-A
Manufacturer:
Renesas Electronics
Description:
Transistor Output Optocouplers Hi Col-Emit Dar 1-Ch
Lifecycle:
New from this manufacturer.
Delivery:
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