DATA SHEET
SE2595L: Dual-Band 802.11n Wireless LAN Front-End
Preliminary Information
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202433A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012 15
L
C
L
C
PERIPHERAL PAD
PATTERN DETAIL
30
29 28
3232
27
3
2
1
4
5
6
17
18
19
21
20
22
26 25
24
23
9 10
11
87
12
13
14
15 16
PCB SOLDER STENCIL
TOP (X-Ray) VIEW
30
29 28
3232
27
3
2
1
4
5
6
17
18
19
21
20
22
26 25
24
23
9 10
11
87
12
13
14
15 16
30
29 28
3232
27
3
2
1
4
5
6
17
18
19
21
20
22
26 25
24
23
9 10
11
87
12
13
14
15 16
PCB SOLDER MASK
TOP (X-Ray) VIEW
PCB METAL & VIA HOLE
TOP (X-Ray) VIEW
RECOMMENDED FOOTPRINT NOTES:
1. VIA HOLE INFORMATION:
1a. RECOMMENDED VIA HOLE SIZE (Ø): 0.150 - 0.300mm
1b. RECOMMENDED VIA HOLE PITCH: AS SHOWN
1c. RECOMMENDED VIA WALL Cu PLATING: 30-35um
1d. RECOMMENDED THAT VIAS BE TENTED WITH SOLDERMASK ON PCB BACKSIDE AND
FILLED WITH SOLDER.
1e. TOTAL VIA COUNT AS SHOWN: 28.
2. SOLDER MASK GEOMETRY FEATURES:
2a. ALL PERIPHERAL PCB PADS ARE NON-SOLDER MASK DEFINED.
2b. ALL GROUND PADDLE FEATURES ARE SOLDER MASK DEFINED.
3. SOLDER STENCIL APERTURE FEATURES:
3a. SOLDER STENCIL APERATURE OPENINGS ARE SMALLER THEN PERIPHERAL PCB METAL PADS.
3b. RECOMMENDED SOLDER STENCIL APERTURE ARRAY TO TARGET APPROXIMATELY
50 - 80% COVERAGE OF SOLDER MASK OPENINGS, EXCEPT AS NOTED.
4. RECOMMENDED SOLDER STENCIL THICKNESS: 5.0mils (0.127mm).
5. PCB ACAD AND GERBER FILES AVAILABLE UPON REQUEST.
GENERAL NOTES:
A. ALL DIMENSIONS ARE IN MILLIMETERS.
B. DIMENSIONING AND TOLERANCES
CONFORM TO ASME Y14.5M-1994.
(UNLESS OTHERWISE SPECIFIED
THE FOLLOWING VALUES APPLY)
DECIMAL TOLERANCE:
X.X (1 PLC) ± 0.1mm
X.XX (2 PLC) ± 0.05mm
X.XXX (3 PLC) ± 0.025mm
ANGULAR TOLERANCE:
± 1°
C. UNLESS SPECIFIED DIMENSIONS ARE
SYMMETRICAL ABOUT CENTER LINES.
QFN
PACKAGE OUTLINE
Figure 5: Recommended Land and Solder Pattern
Package Handling Information
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE2595L is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended, please refer to:
“Quad Flat No-Lead Module Solder Reflow & Rework Information”, Document Number QAD-00045
“Handling, Packing, Shipping and Use of Moisture Sensitive QFN”, Document Number QAD-00044
“ESD Control Policy”, Document Number SQ03-0062
Caution! Class 0 ESD sensitive device
