LTC2925
24
2925fd
For more information www.linear.com/LTC2925
package DescripTion
4.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
2423
1
2
BOTTOM VIEW—EXPOSED PAD
2.45 ±0.10
(4-SIDES)
0.75 ±0.05
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF24) QFN 0105 REV B
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.45 ±0.05
(4 SIDES)
3.10 ±0.05
4.50 ±0.05
PACKAGE OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697 Rev B)
Please refer to http://www.linear.com/product/LTC2925#packaging for the most recent package drawings.
