General Description
DDR2 SDRAM modules are high-speed, CMOS dynamic random access memory mod-
ules that use internally configured 4 or 8-bank DDR2 SDRAM devices. DDR2 SDRAM
modules use DDR architecture to achieve high-speed operation. DDR2 architecture is
essentially a 4n-prefetch architecture with an interface designed to transfer two data
words per clock cycle at the I/O pins. A single read or write access for the DDR2 SDRAM
module effectively consists of a single 4n-bit-wide, one-clock-cycle data transfer at the
internal DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data
transfers at the I/O pins.
DDR2 modules use two sets of differential signals: DQS, DQS# to capture data and CK
and CK# to capture commands, addresses, and control signals. Differential clocks and
data strobes ensure exceptional noise immunity for these signals and provide precise
crossing points to capture input signals. A bidirectional data strobe (DQS, DQS#) is
transmitted externally, along with data, for use in data capture at the receiver. DQS is a
strobe transmitted by the DDR2 SDRAM device during READs and by the memory con-
troller during WRITEs. DQS is edge-aligned with data for READs and center-aligned
with data for WRITEs.
DDR2 SDRAM modules operate from a differential clock (CK and CK#); the crossing of
CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. Com-
mands (address and control signals) are registered at every positive edge of CK. Input
data is registered on both edges of DQS, and output data is referenced to both edges of
DQS, as well as to both edges of CK.
Serial Presence-Detect EEPROM Operation
DDR2 SDRAM modules incorporate serial presence-detect. The SPD data is stored in a
256-byte EEPROM. The first 128 bytes are programmed by Micron to identify the mod-
ule type and various SDRAM organizations and timing parameters. The remaining 128
bytes of storage are available for use by the customer. System READ/WRITE operations
between the master (system logic) and the slave EEPROM device occur via a standard
I
2
C bus using the DIMM’s SCL (clock) SDA (data), and SA (address) pins. Write protect
(WP) is connected to V
SS
, permanently disabling hardware write protection.
Register and PLL Operation
DDR2 SDRAM modules operate in registered mode, where the command/address input
signals are latched in the registers on the rising clock edge and sent to the DDR2
SDRAM devices on the following rising clock edge (data access is delayed by one clock
cycle). A phase-lock loop (PLL) on the module receives and redrives the differential
clock signals (CK, CK#) to the DDR2 SDRAM devices. The registers and PLL minimize
system and clock loading. PLL clock timing is defined by JEDEC specifications and en-
sured by use of the JEDEC clock reference board. Registered mode will add one clock
cycle to CL.
Parity Operations
The registering clock driver can accept a parity bit from the system’s memory control-
ler, providing even parity for the control, command, and address bus. Parity errors are
flagged on the Err_Out# pin. Systems not using parity are expected to function without
issue if Par_In and Err_Out# are left as no connects (NC) to the system.
512MB, 1GB (x72, ECC, SR) 244-Pin DDR2 SDRAM Mini-RDIMM
General Description
PDF: 09005aef83f993e9
htf9c64_128x72pkz.pdf – Rev. C 4/14 EN
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
Electrical Specifications
Stresses greater than those listed may cause permanent damage to the DRAM devices
on the module. This is a stress rating only, and functional operation of the module at
these or any other conditions above those indicated in each device’s data sheet is not
implied. Exposure to absolute maximum rating conditions for extended periods may
adversely affect reliability.
Table 7: Absolute Maximum Ratings
Symbol Parameter Min Max Units
V
DD
/V
DDQ
V
DD
/V
DDQ
supply voltage relative to V
SS
–0.5 2.3 V
V
IN
, V
OUT
Voltage on any pin relative to V
SS
–0.5 2.3 V
I
I
Input leakage current; Any input 0V V
IN
V
DD
;
V
REF
input 0V V
IN
0.95V (All other pins not under
test = 0V)
Command/address
RAS#, CAS#, WE#, S#,
CKE, ODT, BA
–5 5 µA
CK, CK# –250 250
DM –5 5
I
OZ
Output leakage current; 0V V
OUT
V
DDQ
; DQs and
ODT are disabled
DQ, DQS, DQS# –5 5 µA
I
VREF
V
REF
leakage current; V
REF
= valid V
REF
level –18 18 µA
T
A
Module ambient operating temperature Commercial 0 70 °C
Industrial –40 85 °C
T
C
1
DDR2 SDRAM component case operating tempera-
ture
2
Commercial 0 85 °C
Industrial –40 95 °C
Notes:
1. Refresh rate is required to double when 85°C < T
C
95°C.
2. For further information, refer to technical note TN-00-08: “Thermal Applications,” avail-
able on Micron’s web site.
512MB, 1GB (x72, ECC, SR) 244-Pin DDR2 SDRAM Mini-RDIMM
Electrical Specifications
PDF: 09005aef83f993e9
htf9c64_128x72pkz.pdf – Rev. C 4/14 EN
8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
I
DD
Specifications
Table 8: I
DD
Specifications and Conditions – 512MB (Die Revision G)
Values shown for MT47H64M8 DDR2 SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) com-
ponent data sheet
Parameter/Condition Symbol
-80E
-800 -667 Units
Operating one bank active-precharge current:
t
CK =
t
CK (I
DD
),
t
RC =
t
RC (I
DD
),
t
RAS =
t
RAS MIN (I
DD
); CKE is HIGH, S# is HIGH between valid commands; Address
bus inputs are switching; Data bus inputs are switching
I
DD0
585 540 mA
Operating one bank active-read-precharge current: I
OUT
= 0mA; BL = 4, CL = CL
(I
DD
), AL = 0;
t
CK =
t
CK (I
DD
),
t
RC =
t
RC (I
DD
),
t
RAS =
t
RAS MIN (I
DD
),
t
RCD =
t
RCD (I
DD
);
CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are switching;
Data pattern is same as I
DD4W
I
DD1
675 630 mA
Precharge power-down current: All device banks idle;
t
CK =
t
CK (I
DD
); CKE is LOW;
Other control and address bus inputs are stable; Data bus inputs are floating
I
DD2P
63 63 mA
Precharge quiet standby current: All device banks idle;
t
CK =
t
CK (I
DD
); CKE is
HIGH, S# is HIGH; Other control and address bus inputs are stable; Data bus inputs
are floating
I
DD2Q
216 198 mA
Precharge standby current: All device banks idle;
t
CK =
t
CK (I
DD
); CKE is HIGH, S#
is HIGH; Other control and address bus inputs are switching; Data bus inputs are
switching
I
DD2N
252 225 mA
Active power-down current: All device banks open;
t
CK =
t
CK
(I
DD
); CKE is LOW; Other control and address bus inputs are stable;
Data bus inputs are floating
Fast PDN exit
MR[12] = 0
I
DD3P
162 135 mA
Slow PDN exit
MR[12] = 1
81 81 mA
Active standby current: All device banks open;
t
CK =
t
CK (I
DD
),
t
RAS =
t
RAS MAX
(I
DD
),
t
RP =
t
RP (I
DD
); CKE is HIGH, S# is HIGH between valid commands; Other control
and address bus inputs are switching; Data bus inputs are switching
I
DD3N
297 270 mA
Operating burst write current: All device banks open; Continuous burst writes;
BL = 4, CL = CL (I
DD
), AL = 0;
t
CK =
t
CK (I
DD
),
t
RAS =
t
RAS MAX (I
DD
),
t
RP =
t
RP (I
DD
);
CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are switching;
Data bus inputs are switching
I
DD4W
1125 1035 mA
Operating burst read current: All device banks open; Continuous burst reads; I
OUT
= 0mA; BL = 4, CL = CL (I
DD
), AL = 0;
t
CK =
t
CK (I
DD
),
t
RAS =
t
RAS MAX (I
DD
),
t
RP =
t
RP
(I
DD
); CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are
switching; Data bus inputs are switching
I
DD4R
1080 990 mA
Burst refresh current:
t
CK =
t
CK (I
DD
); REFRESH command at every
t
RFC (I
DD
) inter-
val; CKE is HIGH, S# is HIGH between valid commands; Other control and address bus
inputs are switching; Data bus inputs are switching
I
DD5
855 810 mA
Self refresh current: CK and CK# at 0V; CKE 0.2V; Other control and address bus
inputs are floating; Data bus inputs are floating
I
DD6
63 63 mA
Operating bank interleave read current: All device banks interleaving reads;
I
OUT
= 0mA; BL = 4, CL = CL (I
DD
), AL =
t
RCD (I
DD
) - 1 ×
t
CK (I
DD
);
t
CK =
t
CK (I
DD
),
t
RC =
t
RC (I
DD
),
t
RRD =
t
RRD (I
DD
),
t
RCD =
t
RCD (I
DD
); CKE is HIGH, S# is HIGH between valid
commands; Address bus inputs are stable during deselects; Data bus inputs are
switching
I
DD7
1350 1260 mA
512MB, 1GB (x72, ECC, SR) 244-Pin DDR2 SDRAM Mini-RDIMM
I
DD
Specifications
PDF: 09005aef83f993e9
htf9c64_128x72pkz.pdf – Rev. C 4/14 EN
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.

MT9HTF12872PKZ-80EH1

Mfr. #:
Manufacturer:
Micron
Description:
DRAM Module DDR2 SDRAM 1Gbyte 244MiniRDIMM
Lifecycle:
New from this manufacturer.
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