ESD5481
www.onsemi.com
6
PACKAGE DIMENSIONS
X3DFN2, 0.62x0.32, 0.355P, (0201)
CASE 152AF
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A B
E
D
BOTTOM VIEW
b
e
2X
L22X
TOP VIEW
2X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
DIM MIN MAX
MILLIMETERS
A 0.25 0.33
A1 −−− 0.05
b 0.22 0.28
e 0.355 BSC
L2 0.17 0.23
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.74
1
0.30
0.31
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
2
1
See Application Note AND8398/D for more mounting details
A
M
0.05 BC
A
M
0.05 BC
2X
2X
RECOMMENDED
PIN 1
INDICATOR
(OPTIONAL)
D 0.58 0.66
E 0.28 0.36
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