©2012 Silicon Storage Technology, Inc. DS25023B 06/13
Data Sheet
www.microchip.com
1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash
SST39LF010 / SST39LF020 / SST39LF040
SST39VF010 / SST39VF020 / SST39VF040
Features
Organized as 128K x8 / 256K x8 / 512K x8
Single Voltage Read and Write Operations
3.0-3.6V for SST39LF010/020/040
2.7-3.6V for SST39VF010/020/040
Superior Reliability
Endurance: 100,000 Cycles (typical)
Greater than 100 years Data Retention
Low Power Consumption
(typical values at 14 MHz)
Active Current: 5 mA (typical)
Standby Current: 1 µA (typical)
Sector-Erase Capability
Uniform 4 KByte sectors
Fast Read Access Time:
55 ns for SST39LF010/020/040
70 ns for SST39VF010/020/040
Latched Address and Data
Fast Erase and Byte-Program:
Sector-Erase Time: 18 ms (typical)
Chip-Erase Time: 70 ms (typical)
Byte-Program Time: 14 µs (typical)
Chip Rewrite Time:
2 seconds (typical) for SST39LF/VF010
4 seconds (typical) for SST39LF/VF020
8 seconds (typical) for SST39LF/VF040
Automatic Write Timing
Internal V
PP
Generation
End-of-Write Detection
Toggle Bit
– Data# Polling
CMOS I/O Compatibility
JEDEC Standard
Flash EEPROM Pinouts and command sets
Packages Available
– 32-lead PLCC
32-lead TSOP (8mm x 14mm)
All devices are RoHS compliant
The SST39LF010, SST39LF020, SST39LF040 and SST39VF010, SST39VF020,
SST39VF040 are 128K x8, 256K x8 and 5124K x8 CMOS Multi-Purpose Flash
(MPF) manufactured with SST’s proprietary, high performance CMOS SuperFlash
technology. The split-gate cell design and thick-oxide tunneling injector attain bet-
ter reliability and manufacturability compared with alternate approaches. The
SST39LF010/020/040 devices write (Program or Erase) with a 3.0-3.6V power
supply. The SST39VF010/020/040 devices write with a 2.7-3.6V power supply.
The devices conform to JEDEC standard pinouts for x8 memories.
©2012 Silicon Storage Technology, Inc. DS25023B 06/13
2
1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39LF010 / SST39LF020 / SST39LF040
SST39VF010 / SST39VF020 / SST39VF040
Data Sheet
Product Description
The SST39LF010, SST39LF020, SST39LF040 and SST39VF010, SST39VF020, SST39VF040 are
128K x8, 256K x8 and 5124K x8 CMOS Multi-Purpose Flash (MPF) manufactured with SST’s proprie-
tary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tun-
neling injector attain better reliability and manufacturability compared with alternate approaches. The
SST39LF010/020/040 devices write (Program or Erase) with a 3.0-3.6V power supply. The
SST39VF010/020/040 devices write with a 2.7-3.6V power supply. The devices conform to JEDEC
standard pinouts for x8 memories.
Featuring high performance Byte-Program, the SST39LF010/020/040 and SST39VF010/020/040
devices provide a maximum Byte-Program time of 20 µsec. These devices use Toggle Bit or Data#
Polling to indicate the completion of Program operation. To protect against inadvertent write, they have
on-chip hardware and Software Data Protection schemes. Designed, manufactured, and tested for a
wide spectrum of applications, they are offered with a guaranteed typical endurance of 100,000 cycles.
Data retention is rated at greater than 100 years.
The SST39LF010/020/040 and SST39VF010/020/040 devices are suited for applications that require
convenient and economical updating of program, configuration, or data memory. For all system appli-
cations, they significantly improves performance and reliability, while lowering power consumption.
They inherently use less energy during Erase and Program than alternative flash technologies. The
total energy consumed is a function of the applied voltage, current, and time of application. Since for
any given voltage range, the SuperFlash technology uses less current to program and has a shorter
erase time, the total energy consumed during any Erase or Program operation is less than alternative
flash technologies. These devices also improve flexibility while lowering the cost for program, data, and
configuration storage applications.
The SuperFlash technology provides fixed Erase and Program times, independent of the number of
Erase/Program cycles that have occurred. Therefore the system software or hardware does not have
to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Pro-
gram times increase with accumulated Erase/Program cycles.
To meet surface mount requirements, the SST39LF010/020/040 and SST39VF010/020/040 devices
are offered in 32-lead PLCC and 32-lead TSOP packages. See Figures 2 and 3 for pin assignments.
©2012 Silicon Storage Technology, Inc. DS25023B 06/13
3
1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39LF010 / SST39LF020 / SST39LF040
SST39VF010 / SST39VF020 / SST39VF040
Data Sheet
Block Diagram
Figure 1: Functional Block Diagram
Y-Decoder
I/O Buffers and Data Latches
1150 B1.1
Address Buffers & Latches
X-Decoder
DQ
7
- DQ
0
Memory Address
OE#
CE#
WE#
SuperFlash
Memory
Control Logic

SST39VF010-70-4I-WHE

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 128K X 8 70ns
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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