©2012 Silicon Storage Technology, Inc. DS25023B 06/13
25
1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39LF010 / SST39LF020 / SST39LF040
SST39VF010 / SST39VF020 / SST39VF040
Data Sheet
Packaging Diagrams
Figure 19:32-lead Plastic Lead Chip Carrier (PLCC)
SST Package Code: NH
©2012 Silicon Storage Technology, Inc. DS25023B 06/13
26
1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39LF010 / SST39LF020 / SST39LF040
SST39VF010 / SST39VF020 / SST39VF040
Data Sheet
Figure 20:32-lead Thin Small Outline Package (TSOP) 8mm x 14mm
SST Package Code: WH
32-tsop-WH-7
Note: 1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
1.20
max.
1mm
Pin # 1 Identifier
12.50
12.30
14.20
13.80
0.70
0.50
8.10
7.90
0.27
0.17
0.50
BSC
1.05
0.95
0.15
0.05
0.70
0.50
0°- 5°
DETAIL
©2012 Silicon Storage Technology, Inc. DS25023B 06/13
27
1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39LF010 / SST39LF020 / SST39LF040
SST39VF010 / SST39VF020 / SST39VF040
Data Sheet
Table 14: Revision History
Number Description Date
01
2000 Data Book
Feb 2000
02
Changed speed from 45 ns to 55 ns for the SST39LF020 and
SST39LF040
Aug 2000
03
2002 Data Book: Reintroduced the 45 ns parts for the SST39LF020 and
SST39LF040
Feb 2002
04
Added the B3K package for the 2 Mbit devices
Added footnote in Table 8 to indicate I
DD
Write is 30 mA max for Erase
operations in the Industrial temperature range.
Oct 2002
05
Changes to Table 8 on page 12
Added footnote for MPF power usage and Typical conditions
Clarified the Test Conditions for Power Supply Current and Read parameters
Clarified I
DD
Write to be Program and Erase
Corrected I
DD
Program and Erase from 20 mA to 30 mA
Part number changes - see page 23 for additional information
Mar 2003
06
Added new “MM” Micro-Package MPNs for 1M and 2M LF parts- see
page 23
Oct 2003
07
2004 Data Book
Added non-Pb MPNs and removed footnote (See page 23)
Updated B3K and MM package diagrams
Nov 2003
08
Added RoHS Compliant statement.
Added 4 MBit to Figure 4.
Revised Absolute Max Stress Ratings for Surface Mount Solder Reflow
Temperature
Removed SST39VFxxx-90 Timing Parameters from Figure 12.
Added Footnote and removed Read Access Speed 90 = 90 to Product
Ordering Information.
Removed 90 part numbers Valid Combinations lists
Dec 2005
09
Edited page Valid Combinations on page 21. Changed 39LF040-70-4C-
B3KE to 39LF040-45-4C-B3KE
Jan 2006
10
Removed leaded parts
Nov 2008
11
Added package YME
Feb 2009
12
Revised “Product Ordering Information” on page 23
Apr 2009
13
Changed endurance from 10,000 to 100,000 in Product Description, page
1
Sep 2009
14
EOL of SST39LF010-45-4C-YME. Replacement part is SST39LF010-45-
4C-MME in this document.
Removed all references to the YME package.
Jan 2010
A
EOL of SST39LF512 and SST39VF512 parts. Replacement parts are
SST39LF010 and SST39VF010.
Applied new document format.
Released document under letter revision system.
Updated spec number S71150 to DS25023.
Aug 2011

SST39VF010-70-4I-WHE

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 128K X 8 70ns
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union