MT48H16M32L2F5-10 TR

®
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All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
for production devices. Although considered final, these specifications are subject to change, as further product
development and data characterization sometimes occur.
512Mb : x32 TwinDie Mobile SDRAM Addendum
Package Dimensions
PDF: 09005aef817f1b8c/Source: 09005aef818112f1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb Mobile SDRAM_TwinDie_x32.fm - Rev. C 6/05 EN
10 ©2004 Micron Technology, Inc. All rights reserved.
Package Dimensions
Figure 6: 90-Ball FBGA (8mm x 13mm)
Notes: 1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.4mm ±0.025mm.
BALL A1 ID
1.40 MAX
MOLD COMPOUND:
EPOXY NOVOLAC
SUBSTRATE MATERIAL:
PLASTIC LAMINATE
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED
BALL PADS: Ø0.40
13.00 ±0.10
BALL A1
BALL A9
BALL A1 ID
0.80 TYP
0.80 TYP
6.50 ±0.05
8.00 ±0.10
4.00 ±0.053.20
5.60
1.00 ±0.05
SEATING
PLANE
C
11.20
6.40
0.10 C
90X Ø0.45
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS Ø0.42
C
L
C
L

MT48H16M32L2F5-10 TR

Mfr. #:
Manufacturer:
Micron
Description:
IC DRAM 512M PARALLEL 90VFBGA
Lifecycle:
New from this manufacturer.
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