NB4N111KMNR4G

© Semiconductor Components Industries, LLC, 2011
September, 2011 Rev. 5
1 Publication Order Number:
NB4N111K/D
NB4N111K
3.3V Differential In 1:10
Differential Fanout Clock
Driver with HCSL Level
Output
Description
The NB4N111K is a differential input clock 1 to 10 HCSL fanout
buffer, optimized for ultra low propagation delay variation. The
NB4N111K is designed with HCSL clock distribution for FBDIMM
applications in mind.
Inputs can accept differential LVPECL, CML, or LVDS levels.
Singleended LVPECL, CML, LVCMOS or LVTTL levels are
accepted with the proper V
REFAC
supply (see Figures 5, 10, 11, 12,
and 13). Clock input pins incorporate an internal 50 W on die
termination resistors. Outputs can interface with LVDS with proper
termination (See Figure 15).
The NB4N111K specifically guarantees low output–to–output
skews. Optimal design, layout, and processing minimize skew within
a device and from device to device. System designers can take
advantage of the NB4N111K’s performance to distribute low skew
clocks across the backplane or the motherboard.
Features
Typical Input Clock Frequencies: 100, 133, 166, 200, 266, 333, and
400 MHz
340 ps Typical Rise and Fall Times
800 ps Typical Propagation Delay
Dtpd 100 ps Maximum Propagation Delay Variation Per Each
Differential Pair
<1 ps RMS Additive Clock jitter
Operating Range: V
CC
= 3.0 V to 3.6 V with V
EE
= 0 V
Differential HCSL Output Level or LVDS with Proper Termination
These are PbFree Devices
A = Assembly Site
WL = Wafer Lot
YY = Year
WW = Work Week
G = PbFree Package
*For additional marking information, refer to
Application Note AND8002/D.
QFN32
MN SUFFIX
CASE 488AM
MARKING DIAGRAM*
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NB4N
111K
AWLYYWWG
1
32
Figure 1. Pin Configuration (Top View)
Q0
Q0
Q1
Q1
Q8
Q8
Q9
Q9
CLK
CLK
V
CC
GND
R
REF
I
REF
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
ORDERING INFORMATION
VTCLK
VTCLK
32
1
NB4N111K
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2
Figure 2. Pinout Configuration (Top View)
VCC
Q0
Q1
Q1
Q2
Q2
VCC
I
REF
VCC
Q3
Q9
Q5
VCC
VCC
Q8
Q7
Q8
Q7
1
2
3
4
5
6
7
8
VTCLK
CLK
CLK
VTCLK
Q9
GND
9
10
11
12
13
14
15
16
Q6
Q6
VCC
24
23
22
21
20
19
18
17
Q5
Q4
Q4
Q3
32
31
30
29
28
27
26
25
Q0
Exposed Pad (EP)
NB4N111K
Table 1. PIN DESCRIPTION
Pin Name I/O Description
1 I
REF
Output Output current programming pin. Connect to GND. (See Figure 9).
2, 5 VTCLK,
VTCLK
Internal 50 W Termination Resistor connection Pins. In the differential configuration
when the input termination pins are connected to the common termination voltage,
and if no signal is applied then the device may be susceptible to selfoscillation.
3 CLK LVPECL Input CLOCK Input (TRUE)
4 CLK LVPECL Input CLOCK Input (INVERT)
8 GND Supply Ground. GND pin must be externally connected to power supply to
guarantee proper operation.
9, 16, 17, 24, 25, 32 V
CC
Positive Supply pins. V
CC
pins must be externally connected to a power supply to
guarantee proper operation.
6, 10, 12, 14, 18, 20,
22, 26, 28, 30
Q[090] HCSL or
LVDS Output
Noninverted Clock Output. (For LVDS levels see Figure 15)
7, 11, 13, 15, 19, 21,
23, 27, 29, 31
Q[090] HCSL or
LVDS Output
Inverted Clock Output. (For LVDS levels see Figure 15)
Exposed Pad EP GND Exposed Pad. The thermally exposed pad (EP) on package bottom (see case
drawing) must be attached to a sufficient heatsinking conduit for proper thermal
operation. (Note 1)
1. The exposed pad must be connected to the circuit board ground.
NB4N111K
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3
Table 2. ATTRIBUTES
Characteristic Value
Input Default State Resistors None
ESD Protection Human Body Model >2 kV
Moisture Sensitivity (Note 2) QFN32 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 622
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS (Note 3)
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Positive Power Supply GND = 0 V 4.6 V
V
I
Positive Input GND = 0 V GND 0.3 v V
I
v V
CC
V
V
INPP
Differential Input Voltage |CLK CLK| V
CC
V
I
OUT
Output Current Continuous
Surge
50
100
mA
mA
T
A
Operating Temperature Range QFN32 40 to +70 °C
T
stg
Storage Temperature Range 65 to +150 °C
q
JA
Thermal Resistance (JunctiontoAmbient) (Note 3) 0 lfpm
500 lfpm
QFN32
QFN32
31
27
°C/W
°C/W
q
JC
Thermal Resistance (JunctiontoCase) 2S2P (Note 4) QFN32 12 °C/W
T
sol
Wave Solder PbFree 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard 516, multilayer board 2S2P (2 signal, 2 power).
4. JEDEC standard multilayer board 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.

NB4N111KMNR4G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer TSMC 1:10 FANOUT BUF HCSL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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