We guarantee 100% customer satisfaction.
Quality GuaranteesWe provide 90-360 days warranty.
If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.
we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.
Email: info@omo-ic.com
| Part # | Mfg. | Description | Stock | Price |
|---|---|---|---|---|
| SLE77CLF1001PMMCC8IXHSA2 DISTI # SLE77CLF1001PMMCC8IXHSA2 | Infineon Technologies AG | Boosted NFC Secure Element for mobile payment devices - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SLE77CLF1001PMMCC8IXHSA2) RoHS: Compliant Min Qty: 30000 Container: Waffle Pack | Americas - 0 |
| Image | Part # | Description |
|---|---|---|
|
Mfr.#: SLE77CLF1001PMMCC8IXHSA2 |
Security ICs / Authentication ICs TRANSPORT&TICKETING |
|
|
Mfr.#: SLE77CLF1001PMCC8IZZZA1 |
Security ICs / Authentication ICs TRANSPORT&TICKETING |
|
|
Mfr.#: SLE77CLF1001PM MCC8I |
New and Original |
|
|
Mfr.#: SLE77CLF1001PMMCC8IXHSA |
New and Original |