1963854-2

1963854-2
Mfr. #:
1963854-2
Manufacturer:
TE Connectivity
Description:
Heat Sink Passive SFP Pin Array Adhesive Aluminum/Cold-Forged Aluminum Nickel
Lifecycle:
New from this manufacturer.
Datasheet:
1963854-2 Datasheet
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Product Attribute
Attribute Value
Tags
196385, 19638, 1963, 196
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
Part # Mfg. Description Stock Price
1963854-2
DISTI # 19476803
TE Connectivity LtdHeat Sink Passive SFP Pin Array Adhesive Aluminum/Cold-Forged Aluminum Nickel408
  • 3:$11.8800
1963854-2
DISTI # 1963854-2-ND
TE Connectivity LtdHEAT SINK SFP DWDM 10.0MM TALL
RoHS: Compliant
Min Qty: 2100
Container: Tray
Temporarily Out of Stock
  • 2100:$10.8870
1963854-2
DISTI # V36:1790_11853486
TE Connectivity LtdHeat Sink Passive SFP Pin Array Adhesive Aluminum/Cold-Forged Aluminum Nickel0
  • 25200:$6.7960
  • 10500:$7.8740
  • 6300:$9.1630
  • 2100:$10.8900
1963854-2
DISTI # 1963854-2
TE Connectivity LtdHeat Sink Passive SFP Pin Array Adhesive Aluminum/Cold-Forged Aluminum Nickel - Bulk (Alt: 1963854-2)
Min Qty: 2100
Container: Bulk
Americas - 0
    1963854-2
    DISTI # 1963854-2
    TE Connectivity LtdHeat Sink Passive SFP Pin Array Adhesive Aluminum/Cold-Forged Aluminum Nickel - Trays (Alt: 1963854-2)
    RoHS: Compliant
    Min Qty: 2100
    Container: Tray
    Americas - 0
    • 21000:$7.8900
    • 10500:$8.0900
    • 6300:$9.5900
    • 4200:$11.2900
    • 2100:$11.3900
    1963854-2
    DISTI # 1963854-2
    TE Connectivity LtdHeat Sink Passive SFP Pin Array Adhesive Aluminum/Cold-Forged Aluminum Nickel (Alt: 1963854-2)
    RoHS: Compliant
    Min Qty: 420
    Europe - 0
    • 4200:€11.1900
    • 2520:€11.4900
    • 1680:€11.7900
    • 840:€12.0900
    • 420:€12.4900
    1963854-2
    DISTI # 98X0812
    TE Connectivity LtdHEAT SINK SFP DWDM 10.0mm TALL0
    • 500:$11.8500
    • 250:$12.2800
    • 100:$13.9400
    • 50:$15.0700
    • 25:$16.2900
    • 10:$17.2500
    • 1:$18.4700
    1963854-2
    DISTI # 76AC2361
    TE Connectivity LtdHEAT SINK SFP DWDM 10.0MM TALL765
    • 250:$13.8900
    • 100:$14.3400
    • 50:$15.1200
    • 25:$16.6600
    • 10:$17.5500
    • 5:$18.1200
    • 1:$19.1200
    1963854-2
    DISTI # 571-1963854-2
    TE Connectivity LtdHeat Sinks HEAT SINK SFP DWDM 10.0mm TALL0
    • 2100:$11.5800
    1963854-2TE Connectivity LtdHEAT SINK SFP DWDM 10.0mm TALL
    RoHS: Compliant
    408 In Stock
    • 1:$38.5700
    • 25:$36.6400
    • 100:$34.8100
    • 525:$33.0700
    1963854-2
    DISTI # AMP1963854-2
    TE Connectivity LtdHEAT SINK SFP DWDM 10.0mm TALLAmericas - 0
      1963854-2
      DISTI # 19638542
      TE Connectivity Ltd 204
      • 1:$38.5700
      • 25:$36.6400
      • 100:$34.8100
      • 525:$33.0700
      • 1050:$16.9000
      • 1575:$11.4900
      • 2100:$11.2700
      1963854-2 .
      DISTI # 2974247
      TE Connectivity LtdHEAT SINK, ALUM ALLOY, 10MM, SFP DWDM0
      • 3:£17.9600
      1963854-2
      DISTI # AMP1963854-2
      TE Connectivity LtdHEAT SINK SFP DWDM 10.0mm TALL0
        Image Part # Description
        1963094

        Mfr.#: 1963094

        OMO.#: OMO-1963094

        Pluggable Terminal Blocks 8 Pos 3.5mm pitch Through Hole Header
        1963840-2

        Mfr.#: 1963840-2

        OMO.#: OMO-1963840-2

        I/O Connectors GANGED QSFP LAN EXTRUSION HS 1
        1963913

        Mfr.#: 1963913

        OMO.#: OMO-1963913

        Pluggable Terminal Blocks MSTB 2,5/ 6-G THT
        1963123-1

        Mfr.#: 1963123-1

        OMO.#: OMO-1963123-1

        Heat Sinks RADIAL HEATSINK ASSEMBLY
        1963856-1

        Mfr.#: 1963856-1

        OMO.#: OMO-1963856-1

        Heat Sinks CFP HEAT SINK 10.27MM PASSIVE
        1963800-1

        Mfr.#: 1963800-1

        OMO.#: OMO-1963800-1

        Heat Sinks 27MM CLIP WITH 3 FINS HS ASS Y
        1963836-1

        Mfr.#: 1963836-1

        OMO.#: OMO-1963836-1

        Heat Sinks 25MM HEATSINK ASSEMBLY
        1963861-1

        Mfr.#: 1963861-1

        OMO.#: OMO-1963861-1-TE-CONNECTIVITY

        SPRING, 6.35 FL, 4.57 OD, .41 WD
        1963

        Mfr.#: 1963

        OMO.#: OMO-1963-KEYSTONE-ELECTRONICS

        Silicon Manufacturer:-, Core Architecture:-, Core Sub-Architecture:-, Silicon Core Number:-, Silicon Family Name:-, For Use With:Cellular Projects, Kit Contents:GSM Breakout board, Product Rang
        1963573 - MCV 0,5/ 6-G-2,5 THT

        Mfr.#: 1963573 - MCV 0,5/ 6-G-2,5 THT

        OMO.#: OMO-1963573---MCV-0-5-6-G-2-5-THT-1190

        New and Original
        Availability
        Stock:
        Available
        On Order:
        4000
        Enter Quantity:
        Current price of 1963854-2 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@omo-ic.com
        Reference price (USD)
        Quantity
        Unit Price
        Ext. Price
        1
        $0.00
        $0.00
        10
        $0.00
        $0.00
        100
        $0.00
        $0.00
        500
        $0.00
        $0.00
        1000
        $0.00
        $0.00
        Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.
        Start with
        Newest Products
        • Modular Jack Connectors
          TE Connectivity's comprehensive single-port modular jack connectors are designed for the data communications market, suiting applications that require performance in high-speed networking.
        • Automotive Relays
          TE Connectivity's high-performing plug-in relays are available in make, changeover, double make, and bridging make contact arrangements.
        • Z-PACK HM-eZd+ Backplane Connectors
          TE Connectivity's HM-eZd+ backplane connectors enhance electrical performance at true 25 Gbps speeds and are backward compatible with existing HM-Zd connectors.
        Top