OM7690/BFU730F,598

Mfr. #:: OM7690/BFU730F,598
Manufacturer:: NXP Semiconductors
Description:: EVAL BOARD FOR BFU730F
Lifecycle:: New from this manufacturer.
Datasheet:: OM7690/BFU730F,598 Datasheet
Delivery:: DHL FedEx Ups TNT EMS
Payment:: T/T Paypal Visa MoneyGram Western Union
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More Information:: OM7690/BFU730F,598 more Information OM7690/BFU730F,598 Product Details

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Tags: OM769, OM76, OM7

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Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

OM7690/BFU730F,598 Description

***W: Evaluation board for BFU730F

***log Devices: 1800 MHz TO 2700 MHz, 1 W RF Driver Amplifier

***log Devices: Evaluation board for ADL5606

***ark: Evaluation Board, Rf Driver Amplifier; Silicon Manufacturer:analog Devices; Silicon Core Number:adl5606Acpz; Kit Application Type:rf / If; Application Sub Type:rf Driver Amplifier; Kit Contents:evaluation Board Adl5606Acpz Rohs Compliant: Yes

***log Devices: 2200 MHz To 2700 MHz Balanced Mixer, LO Buffer, IF Amplifier, and RF Balun

***ical: ADL5353 Up-Down Converter and Mixer Evaluation Board

***icontronic: Telecom Circuit, 1-Func, BICMOS

***hardson RFPD: FREQUENCY CONTROL EVALUATION BOARD

***ark: ADL5353 EVALUATION BOARD, EB/PCB

***et: ADL5354 Dual Balanced Mixer, LO Buffer, IF Amplifier, and RF Balun Evaluation Board

***ical: ADL5354 Up-Down Converter and Mixer Evaluation Board

***hardson RFPD: FREQUENCY CONTROL EVALUATION BOARD

***ark: ADL5354 EVALUATION BOARD, EB/PCB

***log Devices: The ADL5354 uses a highly linear, doubly balanced, passive mixer core along with integrated RF and local oscillator (LO) balancing circuitry to allow single-ended operation. The ADL5354 incorporates the RF baluns, allowing for optimal performance over a 2200 MHz to 2700 MHz RF input frequency range. The balanced passive mixer arrangement provides good LO-to-RF leakage, typically better than −37 dBm, and excellent intermodulation performance. The balanced mixer core also provides extremely high input linearity, allowing the device to be used in demanding cellular applications where in-band blocking signals may otherwise result in the degradation of dynamic performance. A high linearity IF buffer amplifier follows the passive mixer core to yield a typical power conversion gain of 8 dB and can be used with a wide range of output impedances. The ADL5354 provides two switched LO paths that can be used in time division duplex (TDD) applications where it is desirable to ping-pong between two local oscillators. LO current can be externally set using a resistor to minimize dc current commensurate with the desired level of performance. For low voltage applications, the ADL5354 is capable of operation at voltages as low as 3.3 V with substantially reduced current. For low voltage operation, an additional logic pin is provided to power down (approximately 300 μA) the circuit when desired. The ADL5354 is fabricated using a BiCMOS high performance IC process. The device is available in a 6 mm × 6 mm, 36-lead LFCSP and operates over a −40°C to +85°C temperature range. An evaluation board is also available. Applications Cellular base station receivers Transmit observation receivers Radio link downconverters

***et Europe: ATSAMR21G18A 32-bit Microcontroller Xplained Pro Evaluation Kit

***p One Stop: ATSAMR21G18A Microcontroller Evaluation Kit 0.032MHz/12MHz CPU

***ical: ATSAMR21G18A 802.15.4 LR-WPAN Evaluation Kit

***et Europe: SmartConnect BTLC1000 BLE 4.1 Link Controller Xplained Pro Evaluation Kit

***ure Electronics: Extension Board for Xplained Pro Evaluation Platform

***ical: IC MCU SOC BLE 4.1 ULT LOW 32CSP

***i-Key: KIT XPLAIND PRO EXT ATBTLC1000

***nell: EVAL BRD, BLUETOOTH LOW ENERGY; Silicon Manufacturer: Microchip; Silicon Core Number: ATBTLC1000-MR110CA; Kit Application Type: Wireless Connectivity; Application Sub Type: Bluetooth Low Energy; Kit Contents: Xplained Pro Extension Board ATBTLC1000 ; Product Range: -; SVHC: No SVHC (15-Jan-2018)

***ical: ATWINC1500-MR210-PA 802.11 Wireless LAN Xplained Pro SmartConnect Starter Kit

***ure Electronics: XPRO Wi-Fi Starter Kit w/ Xplained Pro D21 and ATWINC1500-XPRO Wing Board

***ment14 APAC: EVALUATION BOARD, ATWINC1500 SMARTCONNEC

***ark: EVAL BOARD, ATWINC1500 SMARTCONNECT WIFI

***i-Key: KIT XPAINED PROD21 WINC1500-XPRO

***nell: STARTER KIT, ATWINC1500 N/W CONTROLLER; Kit Application Type: Wireless Connectivity; Silicon Manufacturer: Atmel; Silicon Core Number: SAMD21J18A, ATWINC1500; Application Sub Type: Wireless Network; Kit Contents: SAM D21 Xplained Pro Evaluation Board & ATWINC1500-XPRO Extension Card; Product Range: -; SVHC: No SVHC (15-Jan-2018); Features: Low Cost, Low Power 802.11 b/g/n WiFi N/W, On-board Embedded Debugger, Virtual COM-port Interface

Market price

Part #	Mfg.	Description	Stock	Price
OM7690/BFU730F,598 DISTI # 568-8513-ND	NXP Semiconductors	EVAL BOARD FOR BFU730F RoHS: Compliant Min Qty: 1 Container: Box	On Order	10:$200.0000 1:$219.5800
OM7690/BFU730F598 DISTI # OM7690/BFU730F598	Avnet, Inc.	- Bulk (Alt: OM7690/BFU730F598) Min Qty: 1 Container: Bulk	Americas - 0
OM7690/BFU730F,598 DISTI # OM7690/BFU730F,598	Avnet, Inc.	OM7690/BFU730F,598 - Boxed Product (Development Kits) (Alt: OM7690/BFU730F,598) RoHS: Compliant Min Qty: 1 Container: Box	Americas - 0
OM7690/BFU730F,598 DISTI # 771-OM7690BFU730F598	NXP Semiconductors	RF Development Tools 2.3-2.7 GHz LNA BFU730F RoHS: Compliant	2	1:$200.0000

OM7690/BFU730F,598

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes