ECB130ABDCN-Y3

ECB130ABDCN-Y3
Mfr. #:
ECB130ABDCN-Y3
Manufacturer:
Micron
Description:
DRAM LPDDR2 1G Die 32MX32
Lifecycle:
New from this manufacturer.
Datasheet:
ECB130ABDCN-Y3 Datasheet
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
More Information:
ECB130ABDCN-Y3 more Information ECB130ABDCN-Y3 Product Details
Product Attribute
Attribute Value
Manufacturer:
Micron Technology
Product Category:
DRAM
RoHS:
Y
Type:
SDRAM - LPDDR2
Data Bus Width:
32 bit
Organization:
32 M x 32
Package / Case:
Die
Memory Size:
1 Gbit
Series:
ECB
Packaging:
Tray
Brand:
Micron
Product Type:
DRAM
Factory Pack Quantity:
1
Subcategory:
Memory & Data Storage
Tags
ECB1, ECB
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***i-Key
LPDDR2 1G DIE 32MX32
Part # Mfg. Description Stock Price
ECB130ABDCN-Y3
DISTI # V36:1790_07218794
Micron Technology IncLPDDR2 32MX32 DIE-COM 1.2V WIR
RoHS: Compliant
0
    ECB130ABDCN-Y3
    DISTI # ECB130ABDCN-Y3-ND
    Micron Technology IncLPDDR2 1G DIE 32MX32
    RoHS: Not compliant
    Min Qty: 1
    Container: Bulk
    Limited Supply - Call
      ECB130ABDCN-Y3
      DISTI # ECB130ABDCN-Y3
      Micron Technology IncLPDDR2 1G DIE 32MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB130ABDCN-Y3)
      RoHS: Compliant
      Min Qty: 1
      Container: Waffle Pack
      Americas - 0
        ECB130ABDCN-Y3
        DISTI # 340-249809
        Micron Technology IncDRAM LPDDR2 1G Die 32MX32
        RoHS: Compliant
        0
        • 1:$4.9900
        • 10:$4.5500
        • 25:$4.4700
        • 50:$4.4400
        • 100:$3.9800
        • 250:$3.9600
        • 500:$3.7200
        • 1000:$3.5600
        • 2000:$3.4400
        Image Part # Description
        ECB130ABDCN-Y3

        Mfr.#: ECB130ABDCN-Y3

        OMO.#: OMO-ECB130ABDCN-Y3

        DRAM LPDDR2 1G Die 32MX32
        ECB130ABCCN-Y3

        Mfr.#: ECB130ABCCN-Y3

        OMO.#: OMO-ECB130ABCCN-Y3-1190

        New and Original
        ECB130ABDCN-Y3

        Mfr.#: ECB130ABDCN-Y3

        OMO.#: OMO-ECB130ABDCN-Y3-MICRON-TECHNOLOGY

        LPDDR2 1G DIE 32MX32
        Availability
        Stock:
        Available
        On Order:
        2500
        Enter Quantity:
        Current price of ECB130ABDCN-Y3 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@omo-ic.com
        Reference price (USD)
        Quantity
        Unit Price
        Ext. Price
        1
        $4.99
        $4.99
        10
        $4.55
        $45.50
        25
        $4.47
        $111.75
        50
        $4.44
        $222.00
        100
        $3.98
        $398.00
        250
        $3.96
        $990.00
        500
        $3.72
        $1 860.00
        1000
        $3.56
        $3 560.00
        2000
        $3.44
        $6 880.00
        Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.
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