374724B00035G

374724B00035G
Mfr. #:
374724B00035G
Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
Heat Sinks Heatsink for Plastic BGA Packages, Black Anodized, 35x35x18mm, IC Pkg Size = 35 x 35, Tape #35
Lifecycle:
New from this manufacturer.
Datasheet:
374724B00035G Datasheet
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
374724B00035G Datasheet
ECAD Model:
Product Attribute
Attribute Value
Manufacturer:
Aavid
Product Category:
Heat Sinks
RoHS:
Y
Product:
Heat Sinks
Mounting Style:
Adhesive
Fin Style:
Omnidirectional Fin
Thermal Resistance:
15.3 C/W
Length:
35 mm
Width:
35 mm
Height:
18 mm
Designed for:
BGA
Color:
Black
Series:
3747
Brand:
Aavid
Product Type:
Heat Sinks
Factory Pack Quantity:
670
Subcategory:
Heat Sinks
Tags
374724B0, 374724, 37472, 3747, 374
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
Heat Sinks Heatsink for Plastic BGA Packages, Black Anodized, 35x35x18mm, IC Pkg Size = 35 x 35, Tape #35
***et
Heat Sink, For Ball Grid Array, BGA, 15.3 °C/W, 18 mm, 35 mm, 35 mm
***ical
Heat Sink Passive BGA Pin Array Tape 15.3C/W Black Anodized
***i-Key
HEATSINK BGA 35X35X18MM W/ADH
***nell
HEAT SINK BGA 35 X 35 X 18 WITH PAD; IC - Transistor Case:BGA; Thermal Resistance:15.3°C/W; External Width:35mm; Height:18mm; External Height:18mm; Length:35mm; Mounting Type:Adhesive Mount; Package / Case:BGA
***ark
HEAT SINK; Thermal Resistance:15.3�C/W; Packages Cooled:BGA; External Width - Metric:35mm; External Height - Metric:18mm; External Length - Metric:35mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; Product Range:- RoHS Compliant: Yes
***ment14 APAC
HEAT SINK BGA 35 X 35 X 18 WITH PAD; Packages Cooled:BGA; Thermal Resistance:15.3°C/W; SVHC:No SVHC (20-Jun-2011); External Height:18mm; External Width:35mm; Height:18mm; Length:35mm; Mounting Type:Adhesive Mount; Package / Case:BGA; Width:35mm
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Availability
Stock:
277
On Order:
2260
Enter Quantity:
Current price of 374724B00035G is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@omo-ic.com
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