DATASHEET
BoardLevelCooling–3747
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
BOARDLEVELCOOLING–3747
37472isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumber DeviceType
374724B00032G BGA,FPGA
374724B00035G BGA,FPGA
374724B60024G BGA,FPGA
PartNumber:374724B00032G,374724B00035G
Property Details
HeatSinkWidth(mm) 35.00
HeatSinkLength(mm) 35.00
HeatSinkHeight(mm) 18.00
HeatSinkMountingDirection Horizontal,Vertical
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions:
374724B00032G
Tape
DeviceAttachmentOptions:
374724B00035G
Tape
DeviceAttachmentOptions
374724B60024G
SolderAnchorClip
ThermalInterfaceMaterial:
374724B00032G
T405RChomericsTapeforMetal
Surfaces
ThermalInterfaceMaterial:
374724B00035G
T411ChomericsTapeforAllSurfaces
ThermalInterfaceMaterial:
374724B60024G
T766ChomericsPhaseChangeforAll
Surfaces