We guarantee 100% customer satisfaction.
Quality GuaranteesWe provide 90-360 days warranty.
If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.
we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.
Email: info@omo-ic.com
| Part # | Mfg. | Description | Stock | Price |
|---|---|---|---|---|
| SIGC25T60UNX1SA1 DISTI # SIGC25T60UNX1SA1 | Infineon Technologies AG | High Speed IGBT Chip in NPT-technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC25T60UNX1SA1) RoHS: Compliant Min Qty: 153 Container: Waffle Pack | Americas - 0 |
|
| SIGC25T60UNX1SA1 DISTI # SP000013667 | Infineon Technologies AG | High Speed IGBT Chip in NPT-technology (Alt: SP000013667) RoHS: Compliant Min Qty: 1 | Europe - 0 |
|
| Image | Part # | Description |
|---|---|---|
|
Mfr.#: SIGC25T60NCX1SA5 OMO.#: OMO-SIGC25T60NCX1SA5-1190 |
IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC25T60NCX1SA5) |
|
|
Mfr.#: SIGC25T60SNCX1SA2 OMO.#: OMO-SIGC25T60SNCX1SA2-1190 |
Trans IGBT Chip N-CH 600V DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC25T60SNCX1SA2) |
|
|
Mfr.#: SIGC25T60UNX1SA1 OMO.#: OMO-SIGC25T60UNX1SA1-1190 |
High Speed IGBT Chip in NPT-technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC25T60UNX1SA1) |
