1616 Lineage Power
Data Sheet
April 2008Converter: 36 Vdc to 75 Vdc Input, Dual Positive Outputs; 50W
JHW050 Dual Positive Output-Series Power Modules: dc-dc
Reflow Soldering Information
The JHW050 Family of power modules is available for
either trough hole or Surface Mount (SMT) soldering.
These power modules are large mass, low thermal
resistance devices and typically heat up slower than
other SMT components. It is recommended that the
customer review data sheets in order to customize the
solder reflow profile for each application board assem-
ble.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause dam-
age to the modules, and can adversely affect long-term
reliability.
It is recommended that the reflow profile be character-
ized for the module on each application board assem-
bly. The power modules Ball connections are plated
with tin/lead (Sn/Pb) solder to prevent corrosion and
ensure good solderability. Typically, the eutectic solder
melts at 183 °C, wets the land, and subsequently wicks
the device connection. Sufficient time must be allowed
to fuse the plating on the connection to ensure a reli-
able solder joint.
There are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliable soldered using natural
forced convection, IR (radiant infrared), or a combina-
tion of convection/IR. For reliable soldering the solder
reflow profile should be established by accurately mea-
suring the modules Ball connector temperatures.
1-0894
Figure 30.Recommended Reflow Profile
1-0894
Figure 31.Time Limit Curve Above 205 °C Reflow
Lead Free Soldering
Standard JHW050-S power modules are designed to
be used in a conventional Tin/Lead (Sn/Pd) solder pro-
cess where peak reflow temperatures are limited to
less than 235 °C. Users who wish to assemble these
modules in a Lead Free solder process which, it is
expected, will require the use of higher peak reflow
temperatures should contact your local
Lineage Power
technical representative for more information.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will
meet the solder ball requirements per J-STD-001B.
These requirements state that solder balls must neither
be loose nor violate the power module minimum electri-
cal spacing.
The cleanliness designator of the open frame power
module is C00 (per J specification).
Post Solder Cleaning and Drying Consid-
erations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power's Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AP01-56EPS)
0
50
100
150
200
250
300
REFLOW TIME (S)
Peak Temp 235˚C
Heat zone
max 4 ˚Cs
Soak zone
30-240s
Preheat zone
max 4 ˚Cs
-1
Tlim above
205 ˚C
Cooling
zone
1-4 ˚Cs
-1
200
205
210
215
220
225
230
235
240
0 10203040506
0
TIME (S)
