CY7C199C
Document #: 38-05408 Rev. *C Page 4 of 13
Capacitance
[3]
Parameter Description Conditions
Max.
UnitALL – PACKAGES
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
CC
= 5.0V
8 pF
C
OUT
Output Capacitance 8
Thermal Resistance
[4]
Parameter Description Conditions TSOP I SOJ DIP Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5
square inch, two–layer printed
circuit board
88.6 79 69.33 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
21.94 41.42 31.62
AC Test Loads and Waveforms
Notes:
3. Tested initially and after any design or process change that may affect these parameters.
4. Test Conditions assume a transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V.
R1
3.0V
V
CC
R1
R2
GND
90%
90%
10%
1V/ns
1V/ns
V
CC
R2
C2
(a) (b)
OUTPUT V
T
INCLUDING
JIG AND
SCOPE
INCLUDING
JIGAND
SCOPE
10%
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
R
th
output load
output load for
t
HZOE,
t
HZCE,
t
HZWE
C1
CY7C199C
Document #: 38-05408 Rev. *C Page 5 of 13
AC Test Conditions
Parameter Description Nom. Unit
C1 Capacitor 1 30 pF
C2 Capacitor 2 5
R1 Resistor 1 480
R2 Resistor 2 255
R
TH
Resistor Thevenin 167
V
TH
Voltage Thevenin 1.73 V
AC Electrical Characteristics
[5, 6, 7]
Parameter Description
12 ns 15 ns 20 ns
UnitMin Max Min Max Min Max
t
RC
Read Cycle Time 12 15 20 ns
t
AA
Address to Data Valid 12 15 20 ns
t
OHA
Data Hold from Addres Change 3 3 3 ns
t
ACE
CE to Data Valid 12 15 20 ns
t
DOE
OE to Data Valid 5 7 9 ns
t
LZOE
OE to Low Z 0 0 0 ns
t
HZOE
OE to High Z 5 7 9 ns
t
LZCE
CE to Low Z 3 3 3 ns
t
HZCE
CE to High Z 5 7 9 ns
t
PU
CE to Power-up 0 0 0 ns
t
PD
CE to Power-down 12 15 20 ns
t
WC
Write Cycle Time 12 15 20 ns
t
SCE
CE to Write End 9 10 15 ns
t
AW
Address Set-up to Write End 9 10 15 ns
t
HA
Address Hold from Write End 0 0 0 ns
t
SA
Address Set-up to Write Start 0 0 0 ns
t
PWE
WE Pulse Width 8 9 15 ns
t
SD
Data Set-up to Write End 8 9 10 ns
t
HD
Data Hold from Write End 0 0 0 ns
t
HZWE
WE LOW to High Z 7 7 10 ns
t
LZWE
WE HIGH to Low Z 3 3 3 ns
Notes:
5. At any given temperature and voltage condition, t
HZCE
is less than t
LZCE
, t
HZOE
is less than t
LZOE
, and t
HZWE
is less than t
LZWE
for any given device.
6. The internal write time of the memory is defined by the overlap of CE
LOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any
of these signals can terminate the write. The input data set–up and hold timing should be referenced to the leading edge of the signal that terminates the write.
7. t
HZOE
, t
HZCE
, t
HZWE
are specified as in part (b) of the A/C Test Loads. Transitions are measured ± 200 mV from steady state voltage.
CY7C199C
Document #: 38-05408 Rev. *C Page 6 of 13
Data Retention Characteristics
[8]
Parameter Description Condition
ALL
UnitMin. Max.
V
DR
V
CC
for Data Retention 2.0 V
I
CCDR
Data Retention Current V
CC
= V
DR
=2.0V, CE V
CC
– 0.3V,
V
IN
V
CC
– 0.3V or V
IN
0.3V
150 µA
t
CDR
Chip Deselect to Data
Retention Time
0 ns
t
R
Operation Recovery Time 200 µs
Timing Waveforms
Data Retention Waveform
Read Cycle No. 1
[11, 10]
Notes:
8. L-version only.
9. Device is continuously selected. OE
= V
IL
= CE.
10. WE
is HIGH for Read Cycle.
CE
DATA RETENTION MODE
t
CDR
t
R
V
CC
Address
Data Out Previous Data Valid Data Valid
t
RC
t
AA
t
OHA

CY7C199C-15VXC

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 256K PARALLEL 28SOJ
Lifecycle:
New from this manufacturer.
Delivery:
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