DLW5ATN112MQ2L

Spec No. JEFL243C-0026F-01 P 7/11
MURATA MFG CO.,LTD.
Reference Only
13.
!
Caution
13.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames
or other serious trouble.
13.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
14. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
14.1 Flux and Solder
Flux
Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
14.2 Assembling
Products can be applied to reflow and flow soldering.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C max. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body.
14.3 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ I max. Frequency:28kHz to 40kHz Time:5 min max.
(3) Cleaner
1. Cleaner
·Isopropyl alcohol (IPA)
2.Aqueous agent
·PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
14.4 Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So,
please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted
on your board.
right direction
wrong direction
Z
Z
Spec No. JEFL243C-0026F-01 P 8/11
MURATA MFG CO.,LTD.
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
14.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be location the sideways
direction (Length:a
<b) to the mechanical stress.
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A>C>B D.
14.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
•P.C.B. shall be designed so that products are
far from the portion of perforation.
•The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the case
of P.C.B. separation.
•Products shall not be arranged on the
line of a series of holes when there
are big holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
•Support pins shall be set under P.C.B.
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B..
< P.C.B. Separation >
•P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
Poor example
Good example
b
a
Seam
Slit
A
D
B
C
b
a
Lengh:a<b
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
Spec No. JEFL243C-0026F-01 P 9/11
MURATA MFG CO.,LTD.
Reference Only
6.9
1.3
6.0
③④
1.9
14.7 Standard Land Dimensions
Reflow
Flow
(in mm)
14.8 Solder paste printing for reflow
Standard thickness of solder paste
should be 150 to 200µm.
Solderability is subject to reflow condition
and thermal conductivity.
Please make sure that your product has been evaluated
in view of your specifications with our product being
mounted to your product.
Use the solder paste printing pattern of the
right pattern.
For the resist and copper foil pattern,
use standard land dimensions.
(in mm)
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
0.9
2.9
5.5
1.3
3.3
4.7
*
①②③④
indicates terminal number
.
Resist
Copper foil pattern
No pattern
(in mm)
0.9
2.9
5.5
1.3
3.3
4.7

DLW5ATN112MQ2L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Common Mode Chokes / Filters 2000mA 5.0x3.6mm DCR0.040ohm+/-40%
Lifecycle:
New from this manufacturer.
Delivery:
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