MRFG35003ANR5

AR
C
HIVE INF
O
RMATI
O
N
ARCHIVE INFORMATION
MRFG35003NT1 replaced by MRFG35003ANT1.
MRFG35003NT1
1
RF Device Data
Freescale Semiconductor
Gallium Arsenide PHEMT
RF Power Field Effect Transistor
Designed for WLL/MMDS/BWA or UMTS driver applications with frequencies
from 1.8 to 3.6 GHz. Device is unmatched and is suitable for use in Class AB
linear base station applications.
Typical W-CDMA Performance: -42 dBc ACPR, 3.55 GHz, 12 Volts,
I
DQ
= 55 mA, 5 MHz Offset/3.84 MHz BW, 64 DPCH (8.5 dB P/A
@ 0.01% Probability)
Output Power — 300 mWatt
Power Gain — 11.5 dB
Efficiency — 25%
3 Watts P1dB @ 3.55 GHz
Excellent Phase Linearity and Group Delay Characteristics
High Gain, High Efficiency and High Linearity
N Suffix Indicates Lead-Free Terminations. RoHS Compliant.
In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel.
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain-Source Voltage V
DSS
15 Vdc
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
P
D
8.1
(2)
0.05
(2)
W
W/°C
Gate-Source Voltage V
GS
-5 Vdc
RF Input Power P
in
29 dBm
Storage Temperature Range T
stg
-65 to +150 °C
Channel Temperature
(1)
T
ch
175 °C
Operating Case Temperature Range T
C
-20 to +85 °C
Table 2. Thermal Characteristics
Characteristic Symbol Value Unit
Thermal Resistance, Junction to Case Class AB R
θ
JC
18.5
(2)
°C/W
Table 3. Moisture Sensitivity Level
Test Methodology Rating Package Peak Temperature Unit
Per JESD 22-A113, IPC/JEDEC J - STD- 020 1 260 °C
1. For reliable operation, the operating channel temperature should not exceed 150°C.
2. Simulated.
Document Number: MRFG35003N
Rev. 5, 1/2008
Freescale Semiconductor
Technical Data
3.5 GHz, 3 W, 12 V
POWER FET
GaAs PHEMT
MRFG35003NT1
CASE 466-03, STYLE 1
PLD-1.5
PLASTIC
Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.
AR
C
HIVE INF
O
RMATI
O
N
ARCHIVE INFORMATION
2
RF Device Data
Freescale Semiconductor
MRFG35003NT1
Table 4. Electrical Characteristics
(T
C
= 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Saturated Drain Current
(V
DS
= 3.5 Vdc, V
GS
= 0 Vdc)
I
DSS
1.3 Adc
Off State Leakage Current
(V
GS
= -0.4 Vdc, V
DS
= 0 Vdc)
I
GSS
< 1.0 100 µAdc
Off State Drain Current
(V
DS
= 12 Vdc, V
GS
= -2.5 Vdc)
I
DSO
450 µAdc
Off State Current
(V
DS
= 28.5 Vdc, V
GS
= -2.5 Vdc)
I
DSX
< 1.0 7 mAdc
Gate-Source Cut -off Voltage
(V
DS
= 3.5 Vdc, I
DS
= 6.5 mA)
V
GS(th)
-1.2 -0.9 -0.7 Vdc
Quiescent Gate Voltage
(V
DS
= 12 Vdc, I
D
= 55 mA)
V
GS(Q)
-1.2 -0.9 -0.7 Vdc
Power Gain
(V
DD
= 12 Vdc, I
DQ
= 55 mA, f = 3.55 GHz)
G
ps
10 11.5 dB
Output Power, 1 dB Compression Point
(V
DD
= 12 Vdc, I
DQ
= 55 mA, f = 3.55 GHz)
P
1dB
3 W
Drain Efficiency
(V
DD
= 12 Vdc, I
DQ
= 55 mA, P
out
= 0.30 W Avg.,
f = 3.55 GHz)
h
D
23 25 %
Adjacent Channel Power Ratio
(V
DD
= 12 Vdc, P
out
= 0.30 W Avg., I
DQ
= 55 mA,
f = 3.55 GHz, W-CDMA, 8.5 P/A @ 0.01% Probability,
64 CH, 3.84 MCPS)
ACPR -42 -40 dBc
AR
C
HIVE INF
O
RMATI
O
N
ARCHIVE INFORMATION
MRFG35003NT1
3
RF Device Data
Freescale Semiconductor
Z11 0.082 x 0.372Microstrip
Z12 0.169 x 0.471Microstrip
Z13 0.196 x 0.093Microstrip
Z14 0.313 x 0.338Microstrip
Z16 0.200 x 0.065Microstrip
Z17 0.472 x 0.044Microstrip
PCB Rogers 4350, 0.020, ε
r
= 3.5
Figure 1. 3.5 GHz Test Circuit Schematic
Z1, Z18 0.125 x 0.044Microstrip
Z2 0.409 x 0.044Microstrip
Z3 0.326 x 0.288Microstrip
Z4 0.333 x 0.572Microstrip
Z5, Z15 0.527 x 0.015Microstrip
Z6, Z8, Z10 0.050 x 0.025Microstrip
Z7, Z9 0.097 x 0.025Microstrip
C10
RF
INPUT
RF
OUTPUT
R1
C9 C8 C7 C6 C5 C4
C13 C14 C15 C16 C17 C18 C19
C2 C3 C11 C12
Z5 Z15
C21 C22 C24
C25C27C28
C1 C20
Z1 Z2 Z3 Z4 Z10 Z11 Z12 Z13 Z14 Z16 Z17 Z18
V
DD
V
GS
C23
C26
Z9Z8Z6 Z7
Table 5. 3.5 GHz Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C20 7.5 pF Chip Capacitors 100A7R5JP150X ATC
C2, C3, C11, C12 3.9 pF Chip Capacitors (0805) 08051J3R9BBT AVX
C4, C13 10 pF Chip Capacitors 100A100JP500X ATC
C5, C14 100 pF Chip Capacitors 100A101JP500X ATC
C6, C15 100 pF Chip Capacitors 100B101JP500X ATC
C7, C16 1000 pF Chip Capacitors 100B102JP500X ATC
C8, C17 3.9 µF Chip Capacitors ATC
C9, C18 0.1 µF Chip Capacitors ATC
C10, C19 22 µF, 35 V Tantalum Surface Mount Capacitors ATC
C21 0.7 pF Chip Capacitor (0805) 08051J0R7BBT AVX
C22, C27 0.2 pF Chip Capacitors (0805) 08051J0R2BBT AVX
C23, C28 0.8 pF Chip Capacitors (0805) 08051J0R8BBT AVX
C24 1.0 pF Chip Capacitor 08051J1R0BBT AVX
C25 1.2 pF Chip Capacitor 08051J1R2BBT AVX
C26 0.5 pF Chip Capacitor 08051J0R5BBT AVX
R1
100 W Chip Resistor
Newark

MRFG35003ANR5

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
FET RF 15V 3.55GHZ PLD-1.5
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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