ZXTC2062E6
Document Number: DS33647 Rev. 3 - 2
2 of 9
www.diodes.com
March 2015
© Diodes Incorporated
ADVANCE INFO R MA T I O N
Absolute Maximum Ratings – Q1 (NPN Transistor)
(@T
A
= +25°C, unless otherwise specified.)
Collector-Base Voltage
V
100 V
Collector-Emitter Voltage
V
20 V
Emitter-Collector Voltage (reverse blocking)
V
5 V
Emitter-Base Voltage
V
7 V
Continuous Collector Current
I
4 A
Peak Pulsed Collector Current
I
10 A
Base Current
I
1 A
Absolute Maximum Ratings – Q2 (PNP Transistor)
(@T
A
= +25°C, unless otherwise specified.)
Collector-Base Voltage
V
-25 V
Collector-Emitter Voltage
V
-20 V
Emitter-Collector Voltage (reverse blocking)
V
-4 V
Emitter-Base Voltage
V
-7 V
Continuous Collector Current
I
-3.5 A
Peak Pulsed Collector Current
I
-10 A
Base Current
I
-1 A
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Power Dissipation
Linear Derating Factor
(Notes 5 & 9)
P
D
0.7
5.6
W
mW/°C
(Notes 6 & 9)
0.9
7.2
(Notes 6 & 10)
1.1
8.8
(Notes 7 & 9)
1.1
8.8
(Notes 8 & 9)
1.7
13.6
Thermal Resistance, Junction to Ambient
(Notes 5 & 9)
R
θ
JA
179
°C/W
(Notes 6 & 9) 139
(Notes 6 & 10) 113
(Notes 7 & 9) 113
(Notes 8 & 9) 73
Thermal Resistance, Junction to Lead (Note 11)
R
87.5
Operating and Storage Temperature Range
T
, T
-55 to +150 °C
ESD Ratings
(Note 12)
Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A
Electrostatic Discharge - Machine Model ESD MM 400 V C
Notes: 5. For a device surface mounted on 15mm x 15mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured
when operating in a steady-state condition.
6. Same as Note (5), except the device is surface mounted on 25mm x 25mm 1oz copper.
7. Same as Note (5), except the device is surface mounted on 50mm x 50mm 2oz copper.
8. Same as Note (7), except the device is measured at t < 5 seconds.
9. For device with one active die, both collectors attached to a common heatsink.
10. For device with two active dice running at equal power, split heatsink 50% to each collector.
11. Thermal resistance from junction to solder-point (at the end of the collector lead).
12. Refer to JEDEC specification JESD22-A114 and JESD22-A115.