TLP620,TLP620−2,TLP620−4
2014-09-22
2
Made In Japan Made In Thailand
UL recognized E67349 *1 E152349 *1
BSI approved 7426, 7427 *2 7426, 7427 *2
*1 UL1577
*2 BS EN60065: 2002, BS EN60950-1: 2002
• Isolation voltage: 5000V
rms
(min.)
• Option (D4) type
VDE approved: DIN EN 60747-5-2, certificate no.40009302
Maximum operating insulation voltage: 890V
PK
Highest permissible over voltage: 8000V
PK
(Note) When an EN 60747-5-2 approved type is needed,
please designate the “Option(D4)”.
• Creepage distance: 6.4mm (min.)
Clearance: 6.4mm (min.)
Insulation thickness: 0.4mm (min.)
Absolute Maximum Ratings
(Ta = 25°C)
Characteristic Symbol
Rating
Unit
TLP620
TLP620−2
TLP620−4
LED
Forward current I
F (RMS)
60 50 mA
Forward current derating ∆I
F
/ °C −0.7 (Ta ≥ 39°C) −0.5 (Ta ≥ 25°C) mA / °C
Pulse forward current I
FP
1 (100μs pulse, 100pps) A
Power dissipation (1 circuit) P
D
100 70 mW
Power dissipation derating ∆P
D
/ °C −1.0 −0.7 mW / °C
Junction temperature T
j
125 °C
Detector
Collector−emitter voltage V
CEO
55 V
Emitter−collector voltage V
ECO
7 V
Collector current I
C
50 mA
Collector power dissipation
(1 circuit)
P
C
150 100 mW
Collector power dissipation
derating (1 circuit) (Ta ≥ 25°C)
∆P
C
/ °C −1.5 −1.0 mW / °C
Junction temperature T
j
125 °C
Storage temperature range T
stg
−55~125 °C
Operating temperature range T
opr
−55~100 °C
Lead soldering temperature T
sold
260 (10s) °C
Total package power dissipation P
T
250 150 mW
Total package power dissipation
derating (Ta ≥ 25°C, 1 circuit)
∆P
T
/ °C −2.5 −1.5 mW / °C
Isolation voltage BV
S
5000 (AC, 1 min., RH ≤ 60%)
V
rms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).