Characteristics BAT30
4/14 DocID12564 Rev 4
Figure 5. Relative variation of thermal
impedance junction to ambient versus pulse
duration
Figure 6. Relative variation of thermal
impedance junction to ambient versus pulse
duration
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
SOT-666
(s)t
P
Z
th(j-a)
/R
th(j-a)
Epoxy printed board FR4
Coppr thickness = 35 µm
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD-923
(s)t
P
Figure 7. Relative variation of thermal
impedance junction to ambient versus pulse
duration
Figure 8. Thermal resistance junction to
ambient versus copper surface under each lead
(SOD-923)
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
SOD-523
Z
th(j-a)
/R
th(j-a)
(s)t
P
Epoxy printed board FR4
Coppr thickness = 35 µm
0
100
200
300
400
500
600
700
800
900
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Epoxy printed board FR4
Copper thichness = 35 µm
S
CU
(cm²)
R
th(j-a)
(°C/W)
Figure 9. Thermal resistance junction to
ambient versus copper surface under each lead
(SOD-323)
Figure 10. Leakage current versus reverse
applied voltage (typical values)
200
300
400
500
600
0 5 10 15 20 25 30 35 40 45 50
R
th(j-a)
(°C/W)
S
CU
(mm²)
Epoxy printed board FR4
Copper thichness = 35 µm
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 5 10 15 20 25 30
T
j
=150°C
T
j
=25°C
T
j
=85°C
T
j
=125°C
V
R
(V)
I
R
(µA)
