SZMMBZ27VCLT1G

© Semiconductor Components Industries, LLC, 1994
August, 2018 − Rev. 17
1 Publication Order Number:
MMBZ15VDLT1/D
MMBZxxVxL,
SZMMBZxxVxL Series
Zener Diodes, 40 Watt Peak
Power
SOT−23 Dual Common Cathode Zeners
These dual monolithic silicon zener diodes are designed for
applications requiring protection capability. They are intended for use in
voltage and ESD sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment and
other applications. Their dual junction common cathode design protects
two separate lines using only one package. These devices are ideal for
situations where board space is at a premium.
Specification Features:
SOT−23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
Standard Zener Breakdown Voltage Range − 15 V, 27 V, 39 V
Peak Power − 40 W @ 1.0 ms (Bidirectional),
per Figure 5 Waveform
ESD Rating of Class 3B (exceeding 16 kV) per the Human
Body Model
ESD Rating of IEC61000−4−2 Level 4, ±30 kV Contact Discharge
Low Leakage < 100 nA
Flammability Rating: UL 94 V−O
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
SOT−23
CASE 318
STYLE 9
ANODE 1
3 CATHODE
ANODE 2
Device Package Shipping
ORDERING INFORMATION
MARKING DIAGRAM
XXX = 15D, 27C or 39C
M = Date Code
G = Pb−Free Package
1
XXX MG
G
MMBZ15VDLT1G,
SZMMBZ15VDLT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
MMBZxxVCLT1G,
SZMMBZxxVCLT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
MMBZ15VDLT3G,
SZMMBZ15VDLT3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
MMBZxxVCLT3G,
SZMMBZxxVCLT3G
SOT−23
(Pb−Free)
10,000 /
Tape & Reel
(Note: Microdot may be in either location)
www.onsemi.com
MMBZxxVxL, SZMMBZxxVxL Series
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation @ 1.0 ms (Note 1) @ T
L
25°C P
pk
40 Watts
Total Power Dissipation on FR−5 Board (Note 2)
@ T
A
= 25°C
Derate above 25°C
°P
D
°
225
1.8
mW
mW/°C
Thermal Resistance Junction−to−Ambient
R
q
JA
556 °C/W
Total Power Dissipation on Alumina Substrate (Note 3)
@ T
A
= 25°C
Derate above 25°C
°P
D
°
300
2.4
°
mW
mW/°C
Thermal Resistance Junction−to−Ambient
R
q
JA
417 °C/W
Junction and Storage Temperature Range T
J
, T
stg
− 55 to +150 °C
Lead Solder Temperature − Maximum (10 Second Duration) T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Nonrepetitive current pulse per Figure 5 and derate above T
A
= 25°C per Figure 6.
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol
Parameter
I
PP
Maximum Reverse Peak Pulse Current
V
C
Clamping Voltage @ I
PP
V
RWM
Working Peak Reverse Voltage
I
R
Maximum Reverse Leakage Current @ V
RWM
V
BR
Breakdown Voltage @ I
T
I
T
Test Current
V
BR
Maximum Temperature Coefficient of V
BR
I
F
Forward Current
V
F
Forward Voltage @ I
F
Uni−Directional TVS
I
PP
I
F
V
I
I
R
I
T
V
RWM
V
C
V
BR
V
F
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
(V
F
= 0.9 V Max @ I
F
= 10 mA)
Device*
Device
Marking
V
RWM
I
R
@ V
RWM
Breakdown Voltage V
C
@ I
PP
(Note 5)
V
BR
V
BR
(Note 4) (V) @ I
T
V
C
I
PP
Volts nA Min Nom Max mA V A
mV/5C
MMBZ15VDLT1G/T3G 15D 12.8 100 14.3 15 15.8 1.0 21.2 1.9 12
(V
F
= 1.1 V Max @ I
F
= 200 mA)
Device*
Device
Marking
V
RWM
I
R
@ V
RWM
Breakdown Voltage V
C
@ I
PP
(Note 5)
V
BR
V
BR
(Note 4) (V) @ I
T
V
C
I
PP
Volts nA Min Nom Max mA V A
mV/5C
MMBZ27VCLT1G/T3G 27C 22 50 25.65 27 28.35 1.0 38 1.0 26
MMBZ39VCLT1G/T3G 39C 31.2 50 37.05 39 40.95 1.0 55 0.76 35.3
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. V
BR
measured at pulse test current I
T
at an ambient temperature of 25°C.
5. Surge current waveform per Figure 5 and derate per Figure 6
*Include SZ-prefix devices where applicable.
MMBZxxVxL, SZMMBZxxVxL Series
www.onsemi.com
3
-40 +85
17
BREAKDOWN VOLTAGE (VOLTS)
Figure 1. Typical Breakdown Voltage
versus Temperature
TEMPERATURE (°C)
+125
16
15
14
13
(V
BR
@ I
T
)
+25
MMBZ15VDL, SZMMBZ15VDL
-55 +85
29
BREAKDOWN VOLTAGE (VOLTS)
Figure 2. Typical Breakdown Voltage
versus Temperature
TEMPERATURE (°C)
+12
5
28
27
26
25
(V
BR
@ I
T
)
+25
MMBZ27VCL, SZMMBZ27VCL
TYPICAL CHARACTERISTICS
BIDIRECTIONAL
UNIDIRECTIONAL
BIDIRECTIONAL
1000
10
0.01
TEMPERATURE (°C)
I
R
(nA)
Figure 3. Typical Leakage Current
versus Temperature
100
1
0.1
-40 +85 +125+25
0 25 50 75 100 125 150 175
300
250
200
150
100
50
0
Figure 4. Steady State Power Derating Curve
P
D
, POWER DISSIPATION (mW)
TEMPERATURE (°C)
FR-5 BOARD
ALUMINA SUBSTRATE
VALUE (%)
100
50
0
01234
t, TIME (ms)
Figure 5. Pulse Waveform
t
r
10 ms
PULSE WIDTH (t
P
) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO
50% OF I
PP
.
HALF VALUE—
I
PP
2
PEAK VALUE—I
PP
t
P
100
90
80
70
60
50
40
30
20
10
0
0 25 50 75 100 125 150 175 200
T
A
, AMBIENT TEMPERATURE (°C)
Figure 6. Pulse Derating Curve
PEAK PULSE DERATING IN % OF PEAK POWER
OR CURRENT @ T
A
= 25
C
°

SZMMBZ27VCLT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
TVS Diodes / ESD Suppressors ZEN REG .225W SPCL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union