NLSV1T34
www.onsemi.com
9
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
1
3
46
DIM MIN MAX
MILLIMETERS
A −−− 0.40
A1 0.00 0.05
b 0.15 0.25
D 1.45 BSC
E 1.00 BSC
e 0.50 BSC
L 0.25 0.35
L1 0.30 0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.30
5X
0.49
6X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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