MC100EP210SMNG

© Semiconductor Components Industries, LLC, 2011
June, 2011 Rev. 10
1 Publication Order Number:
MC100EP210S/D
MC100EP210S
2.5V 1:5 Dual Differential
LVDS Compatible Clock
Driver
Description
The MC100EP210S is a low skew 1to5 dual differential driver,
designed with LVDS clock distribution in mind. The LVDS or
LVPECL input signals are differential and the signal is fanned out to
five identical differential LVDS outputs.
The EP210S specifically guarantees low outputtooutput skew.
Optimal design, layout, and processing minimize skew within a device
and from device to device.
Two internal 50 W resistors are provided across the inputs. For
LVDS inputs, VTA and VTB pins should be unconnected. For
LVPECL inputs, VTA and VTB pins should be connected to the V
TT
(V
CC
2.0 V) supply.
Designers can take advantage of the EP210S performance to
distribute low skew LVDS clocks across the backplane or the board.
Features
20 ps Typical OutputtoOutput Skew
85 ps Typical DevicetoDevice Skew
550 ps Typical Propagation Delay
The 100 Series Contains Temperature Compensation
Maximum Frequency > 1 GHz Typical
Operating Range: V
CC
= 2.375 V to 2.625 V with V
EE
= 0 V
Internal 50 W Input Termination Resistors
LVDS Input/Output Compatible
These are PbFree Devices
LQFP32
FA SUFFIX
CASE 873A
MARKING
DIAGRAM*
*For additional marking information, refer to
Application Note AND8002/D.
http://onsemi.com
MC100
EP210S
AWLYYWWG
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
xxx = 10 or 100
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = PbFree Package
32
1
MCxxx
EP210S
ALYWG
1
QFN32
MN SUFFIX
CASE 488AM
MC100EP210S
http://onsemi.com
2
CLKn, CLKn LVDS, LVPECL CLK Inputs*
V
CC
25
26
27
28
29
30
31
32
15
14
13
12
11
10
9
12345678
24 23 22 21 20 19 18 17
16
Qb4
Qb4
Qb3
Qb3
Qb2
Qb2
V
CC
V
CC
Qa0
Qa0
Qa1
Qa1
Qa2
Qa2
V
CC
V
EE
VTBV
EE
Qb1Qb1Qb0Qb0Qa4Qa4Qa3 Qa3
Qa0
Qa0
Qa1
Qa1
Qa2
Qa2
Qa3
Qa3
Qa4
Qa4
CLKa
CLKa
VTA
Qb0
Qb0
Qb1
Qb1
Qb2
Qb2
Qb3
Qb3
Qb4
Qb4
CLKb
CLKb
Warning: All V
CC
and V
EE
pins must be externally connected
to Power Supply to guarantee proper operation.
Table 1. PIN DESCRIPTION
PIN
Qn0:4, Qn0:4
LVDS Outputs
FUNCTION
V
CC
Positive Supply
V
EE
Ground
Figure 1. 32Lead LQFP Pinout (Top View)
CLKa
CLKa
CLKb
CLKb
Figure 2. Logic Diagram
VTA
VTB
VTA
50 W 50 W
VTB
50 W 50 W
50 W Termination Resistors
50 W Termination Resistors
MC100EP210S
*Under open or floating conditions with input pins converging to a common termination
bias voltage the device is susceptible to auto oscillation.
V
CC
2526272829303132
1514131211109
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
16
Qb4
Qb4 Qb3 Qb3 Qb2 Qb2 V
CC
V
CC
Qa0 Qa0 Qa1 Qa1 Qa2 Qa2 V
CC
V
EE
VTB
V
EE
Qb1
Qb1
Qb0
Qb0
Qa4
Qa4
Qa3
Qa3
CLKa
CLKa
CLKb
CLKb
VTA
MC100EP210S
Figure 1. 32Lead QFN Pinout (Top View)
The Exposed Pad (EP) on the QFN32 package bottom is
thermally connected to the die for improved heat transfer out
of package. The exposed pad must be attached to a heat
sinking conduit. The pad is electrically connected to V
EE
.
EP for QFN32,
only
MC100EP210S
http://onsemi.com
3
Table 2. ATTRIBUTES
Characteristics Value
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 100 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg PbFree Pkg
LQFP32
QFN32
Level 2 Level 2
Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 461 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, refer to Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Power Supply V
EE
= 0 V 6 V
V
EE
Power Supply (GND) V
CC
= 2.5 V 6 V
V
I
LVDS, LVPECL Input Voltage V
EE
= 0 V V
I
V
CC
6 V
I
out
Output Current Continuous
Surge
50
100
mA
mA
T
A
Operating Temperature Range 40 to +85 °C
T
stg
Storage Temperature Range 65 to +150 °C
q
JA
Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
32 LQFP
32 LQFP
80
55
°C/W
°C/W
q
JC
Thermal Resistance (JunctiontoCase) Standard Board 32 LQFP 12 to 17 °C/W
q
JA
Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
QFN32
QFN32
31
27
°C/W
°C/W
q
JC
Thermal Resistance (JunctiontoCase) 2S2P QFN32 12 °C/W
T
sol
Wave Solder Pb
PbFree
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

MC100EP210SMNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer BBGECL DUAL DIFF CLK DRV
Lifecycle:
New from this manufacturer.
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