4
LTC1327
SUPPLY VOLTAGE (V)
0
14
12
10
8
6
4
2
0
30 50
1327 G06
10 20
40 60 70
SHORT-CIRCUIT CURRENT (mA)
I
SC
–
I
SC
+
DATA RATE (k BAUD)
0
SUPPLY CURRENT (mA)
45
40
35
30
25
20
15
10
5
0
1327 G03
4020 60 80 120100 140
V
CC
= 3.3V
R
L
= 3k
C
L
= 1000pF
3 DRIVERS ACTIVE
V
CC
Supply Current vs Data Rate
CCHARA TERIST
ICS
UW
AT
Y
P
I
CA
LPER
F
O
R
C
E
TEMPERATURE (°C)
0
LEAKAGE CURRENT (µA)
60
45
40
35
30
25
20
15
10
5
0
1327 G05
20 7010
30
40
50
V
OUT
= –20V
V
OUT
= 20V
Driver Leakage in SHUTDOWN
vs Temperature
Driver Short-Circuit Current vs
Supply Voltage
PI FU CTIO S
U
UU
V
CC
: 3.3V Input Supply Pin. Supply current 0.2µA in the
SHUTDOWN mode. This pin should be decoupled with a
0.1µF ceramic capacitor.
GND: Ground Pin.
ON/OFF: TTL/CMOS Compatible Shutdown Pin. A logic
low puts the device in SHUTDOWN mode which reduces
the supply current to 0.2µA and places all drivers and
receivers in high impedance state. This pin cannot float.
V
+
: Positive Supply Output (EIA/TIA-562 Drivers).
V
+
≅ 2V
CC
– 1V. This pin requires an external capacitor
C = 0.1µF for charge storage. The capacitor may be tied to
ground or 3.3V. With multiple devices, the V
+
and V
–
pins
may be paralleled into common capacitors. For large
numbers of devices, increasing the size of the shared
common storage capacitors is recommended to reduce
ripple.
V
–
: Negative Supply Output (EIA/TIA-562 Drivers).
V
–
≅ – (2V
CC
– 1.3). This pin requires an external capacitor
C = 0.1µF for a charge storage.
DRIVER
OUTPUT
R
L
= 3k
DRIVER
OUTPUT
R
L
= 3k
C
L
= 1000pF
INPUT
1327 G08
1327 G09
Driver Output Waveform Receiver Output Waveform
INPUT
RECEIVER
OUTPUT
C
L
= 50pF
Receiver Short-Circuit Current
vs Temperature
TEMPERATURE (°C)
0
SHORT-CIRCUIT CURRENT (mA)
60
1327 G07
20 40
40
35
30
25
20
15
10
5
0
10 30 50 70
I
SC
+
I
SC
–
