CY7C419/21/25/29/33
Document #: 38-06001 Rev. *B Page 22 of 25
Package Diagrams (continued)
51-85002-*B
32-Lead Pb-Free Plastic Leaded Chip Carrier J65
32-Lead Plastic Leaded Chip Carrier J65
32-Pin Rectangular Leadless Chip Carrier L55
MIL-STD-1835 C-12
51-80068-**
CY7C419/21/25/29/33
Document #: 38-06001 Rev. *B Page 23 of 25
Package Diagrams (continued)
51-85017-*A
28-Lead (600-Mil) Molded DIP P15
DIMENSIONS IN INCHES [MM]
MIN.
MAX.
SEATING PLANE
0.260[6.60]
0.295[7.49]
0.090[2.28]
0.110[2.79]
0.055[1.39]
0.065[1.65]
0.015[0.38]
0.020[0.50]
0.015[0.38]
0.060[1.52]
0.120[3.05]
0.140[3.55]
0.009[0.23]
0.012[0.30]
0.310[7.87]
0.385[9.78]
0.290[7.36]
0.325[8.25]
0.030[0.76]
0.080[2.03]
0.115[2.92]
0.160[4.06]
0.140[3.55]
0.190[4.82]
1.345[34.16]
1.385[35.18]
MIN.
114
15 28
REFERENCE JEDEC MO-095
LEAD END OPTION
SEE LEAD END OPTION
SEE LEAD END OPTION
(LEAD #1, 14, 15 & 28)
PACKAGE WEIGHT: 2.15 gms
28-Lead (300-Mil) PDIP P21
51-85014-*D
CY7C419/21/25/29/33
Document #: 38-06001 Rev. *B Page 24 of 25
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
All products and company names mentioned in this document may be the trademarks of their respective holders.
Package Diagrams (continued)
DIMENSIONS IN INCHES
MIN.
MAX.
PIN 1 ID
0.291
0.300
0.050
TYP.
0.007
0.013
0.330
0.350
0.120
0.140
0.025 MIN.
0.262
0.272
0.697
0.713
28 Lead (300 Mil) Molded SOJ V21
0.013
0.019
0.014
0.020
0.032
0.026
A
A
DETAIL
EXTERNAL LEAD DESIGN
OPTION 1 OPTION 2
114
15 28
0.004
SEATING PLANE
51-85031-*B
28-Lead (300-Mil) Molded SOJ V21
28-Lead (300-Mil) Pb-Free Molded SOJ V21

CY7C429-20JXC

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
FIFO 2Kx9 .300" PARALLEL CASCADEABLE FIFO COM
Lifecycle:
New from this manufacturer.
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